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Kai Xia

Researcher at Huazhong University of Science and Technology

Publications -  22
Citations -  408

Kai Xia is an academic researcher from Huazhong University of Science and Technology. The author has contributed to research in topics: Rotor (electric) & Remanufacturing. The author has an hindex of 9, co-authored 20 publications receiving 341 citations. Previous affiliations of Kai Xia include Xi'an Jiaotong University.

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Selective disassembly planning for waste electrical and electronic equipment with case studies on liquid crystaldisplays

TL;DR: In this paper, a Particle Swarm Optimization (PSO)-based selective disassembly planning method embedded with customisable decision making models and a novel generic constraint handling algorithm has been developed.
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Current Status and Future Perspective of Waste Printed Circuit Boards Recycling

TL;DR: In this paper, the authors present the most suitable available technology for waste PCBs, typically categorized as manually dismantling and automatic approaches in developing and developed countries, respectively, to achieve better sustainability and recyclability for waste printed circuit boards, nonmetal powder and precious metals should be developed for a deep recovery following mechanical treatment.
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Disassembly sequence planning using a Simplified Teaching-Learning-Based Optimization algorithm

TL;DR: A Simplified Teaching-Learning-Based Optimization (STLBO) algorithm for solving DSP problems effectively and shows that the developed algorithm performs better than other relevant algorithms under a set of public benchmarks.
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A Semantic Information Services Framework for Sustainable WEEE Management Toward Cloud-Based Remanufacturing

TL;DR: In the proposed framework, an ontology based approach is developed to integrate and represent the lifecycle information from multiple local data sources within an information services provider.
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Disassembly Matrix for Liquid Crystal Displays Televisions

TL;DR: In this article, a space interference matrix is generated to represent the space interference relationship between each component of a product, and all feasible disassembly sequences can be obtained by analysing the interference matrix in six directions in a 3D environment.