A clock signal supply system is disclosed for a semiconductor device with a semiconductor chip and a wiring substrate connected in flip-chip fashion and an optical waveguide interposed in the space between electrode members, in which the mutual arrangement of the electrical interconnection and the optical waveguide interconnection on the wiring substrate is not affected and can be used separately from each other for different applications, thereby improving the throughput of the interconnections as a whole. In order to distribute a very fast clock signal beyond a 1 GHz in particular without any phase deviation in the clock signal supply system, a clock distributor includes a clock oscillator, a phase adjuster for adjusting the phase at each destination of the clock signal, an optical interconnection for supplying the clock signal to the phase adjuster, a reference signal generator for generating a phase reference signal from the clock signal, and an electrical interconnection for supplying the reference signal to the phase adjuster. The clock signal is supplied by an optical interconnection having a broad frequency bandwidth, and the phase reference signal by an electrical interconnection by which the skew is controlled easily. A clock signal adjusted to high phase accuracy can thus be distributed to following destinations by the phase adjuster.

Semiconductor device having an optical waveguide interposed in the space between electrode members

An optoelectronic package with direct free space optical communication between pairs of optical transmitters and receivers located on different substrate surfaces in a closely spaced stack of chip carrying substrates is disclosed. The transmitters and receivers are aligned so that a light beam from each transmitter follows an optical path toward its respective receiver. In the stack of substrates, the transmitters and receivers are mounted on the surfaces of the substrates, many of which are separated by intervening substrates. These intervening substrates have vias, holes or transparent regions, or other optical means, at locations along the optical paths connecting the transmitters and receivers. Lenses or other concentrating means, where required, are adjacent to a transmitter so that its diverging light is focused on the intended receiver. Substrates are aligned so that the light from transmitters shines through the optical means in intervening substrates to the receivers. Means for removing heat from the substrates are included.

High speed optical interconnect

A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.

Method of manufacturing multilayer circuit substrate

In the case of the above devices, accurate adjustment is very important; the devices ought, however, to be very compact. It is not sufficient to utilize the silicon etching technique for accuracy. The optical transmitting element (LD) is located on a first holder (T1), and the optical receiving element (PD) and the transmission fiber (Fa) are located on a third holder. Provided there between is a second holder (T2) which is transparent to the wavelength of the light emitted by the transmitting element (LD). The holders are structured by means of anisotropic etching in order to render it possible to receive the individual components. Furthermore, the holders lie flat on one another and can be so adjusted. A monitor diode (MD) is provided.

Optical transmitting and receiving device having a surface-emitting laser

An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Optical waveguide and method for producing same

A method for manufacturing a multilayer ceramic module structure is described which includes a ceramic body having a plurality of continuous glass channels within the body. The module transmits signals from point to point on the module and to points off of the module by allowing the movement of optical pulses through optical channels rather than the conventional electrical pulses and metal wiring. The method for fabricating the multilayer ceramic module includes providing a plurality of ceramic green sheets. The green sheets are then individually prepared for the circuit pattern plan for the module by opening via holes through certain locations of the various green sheets and forming grooves in other portions of the green sheets for a proper resulting pattern. A glass paste is applied to the green sheets to fill the grooves and the holes therein. The green sheets are then stacked and laminated by the use of suitable pressure. The laminated green sheets are then sintered to form a module package. During sintering, the ceramic fuses around the glass which also softens and fuses to form clear channels within the ceramic body. Glass must sinter fully at the sintering temperature of the ceramic without becoming so fluid that it would run out of the via and grooves into the interstices in the ceramic before the ceramic is fully sintered. This problem is overcome by selection of the ceramic and the glass so that the sintering temperature of the ceramic and the softening temperature of the glass paste are substantially the same.

Kaiser Harold D

Papers

Method of making multilayer module having optical channels therein

Multilayer module having optical channels therein

High capacitance microelectronic decoupling device with low shunt resistance at high frequencies

Verfahren zur herstellung einer optischen schaltung aus einer keramik- glasstruktur