A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.

Fan-out semiconductor package

Known devices for measuring the mass of a flowing medium have a temperature-dependent measuring component which is housed in a measuring channel and around which the flowing medium flows. In a turbulent flow, unstable separation occurring in the measuring channel causes so-called background noise of the measuring signal emitted by the measuring component so that accurate measurement is difficult. The device according to the invention comprises, upstream of the measuring component (20) in the region of an inlet opening (36) in the measuring channel (33), a flow obstacle (50) taking the form of a trip edge (51) in order to generate in the region thereof a temporally and spatially stable separation area (54) such that temporally and spatially unstable separation areas are prevented. In this way the measuring signal background noise can be reduced. The invention is used for measuring the mass of a flowing medium, in particular for measuring the intake air mass of internal combustion engines.

Device for measuring the mass of a flowing medium

The invention comprises method and apparatus for fluid delivery between a sample probe and a sample. The fluid delivery system includes: a fluid reservoir, a delivery channel, a manifold or plenum, a channel or moat, a groove, and/or a dendritic pathway to deliver a thin and distributed layer of a fluid to a sample probe head and/or to a sample site. The fluid delivery system reduces sampling errors due to mechanical tissue distortion, specular reflectance, probe placement, and/or mechanically induced sample site stress/strain associated with optical sampling of the sample.

Method and apparatus for coupling a sample probe with a sample site

Sampling is controlled in order to enhance analyte concentration estimation derived from noninvasive sampling. More particularly, sampling is controlled using controlled fluid delivery to a region between a tip of a sample probe and a tissue measurement site. The controlled fluid delivery enhances coverage of a skin sample site with the thin layer of fluid. Delivery of contact fluid is controlled in terms of spatial delivery, volume, thickness, distribution, temperature, and/or pressure.

Method and apparatus for coupling a channeled sample probe to tissue

The present invention relates to a power semiconductor device such as a diode and thyristor. In a semiconductor device such as a diode and thyristor having at least one pn junction between a pair of main surfaces, a first main electrode is formed on the surface of one of the main surfaces and a second main electrode is formed on the surface of the other one of the main surfaces. A semiconductor lattice defect is formed such that its lattice defect density increases gradually in the direction from the first main electrode to the second main electrode. Since the distribution of carrier density in the conduction state can be flattened according to the invention, the reverse recovery charge can be reduced substantially without causing the ON-state voltage to increase.

Power semiconductor device

A semiconductor pressure transducer assembly comprising a silicon diaphragm assembly and a glass covering member. The silicon diaphragm assembly has a circular diaphragm portion of thin silicon which is formed using etching, and a thick supporting portion therearound. Piezoresistive elements of a piezoresistive bridge circuit and conducting paths for electrically connection thereof are formed on the silicon diaphragm assembly. On a surface of the silicon diaphragm assembly, a passivating layer of silicon dioxide are formed in uniform thickness, and further on a surface of the passivating layer is formed a layer of polysilicon on the supporting portion of the silicon diaphragm assembly. In the passivating layer, a contacting window is formed, through which the polysilicon layer is electrically connected to the silicon diaphragm assembly. The covering member of borosilicate glass having a circular well is mounted and bonded onto the silicon diaphragm assembly in contact with the polysilicon layer using Anodic Bonding method. And the processed silicon diaphragm assembly has a flat surface thereof, on which the piezoresistive elements and the conducting paths are constructed using Ion Implantation method, or reforming a silicon dioxide layer thereon after removing another silicon dioxide layer used as mask in diffusing process.

Semiconductor absolute pressure transducer assembly and method

The invention relates to a bump forming method and a bump forming apparatus having a mask 11 that has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10a on one surface of an object to be processed 10 to mount thereon conductive particles 13, and the plurality of holes are opposite to the plurality of electrode portions 10a formed on the object to be processed. A table 12 has a plurality of holes 12a for sucking the object to be processed 10 from the other surface of the object to be processed 10, and for sucking the particles 13 through the plurality of holes 11a in the mask 11 so that the particles 13 may be mounted on the electrode portions 10a formed on the object to be processed 10. A hopper 14 contains therein the plurality of conductive particles 13, prevents the plurality of conductive particles 13 from adhering to each other, and has a slit portion 17 for dropping the plurality of conductive particles 13 by the self-weight. A slit portion 17 in the hopper 14 is moved, facing the upper surface of the mask 11 with a gap between the slit portion 17 and the upper surface of the mask 11 larger than a diameter of the particle 13, and the hopper 14 is arranged in the front side in the moving direction, and the unit 15 is arranged in the rear side, and the particles 13 not dropped into the holes of the mask being collected by the collecting unit 15.

Bump forming method and bump forming apparatus

A module which can be reduced in size while enhanced in reliability and productivity, and a method for fabricating the same. The module comprises a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components, wherein the connector (6) and the circuit board (1) are connected through a metal lead (7). The connector (6) on the side being connected with the circuit board, the metal lead (7) and the electronic components are sealed with the same thermosetting resin (9) which is in solid state at a temperature of 40 ˚C or below before curing, and the thickness of the thermosetting resin (9) sealing the electronic component depends on the height of the electronic component.

Module and method for fabricating the same

A thermal-type airflow meter comprises an airflow meter body and a measuring part. Both of the frame of a housing which accommodates the electronic circuit, and a sub-passage member which has the heating resistor positioned within a sub-passage, are arranged on a metallic base. Further, the frame, the sub-passage member, the metallic base and the cover are each fixedly attached to at least two respective different members. A connector of the housing, the frame and the sub-passage member are formed in a flat shape to form the measuring module. The measuring module is inserted through an insertion hole to locate the heating resistor within the main air passage, and the fixing flange of the housing is fixedly attached to the airflow meter body.

Thermal-type airflow meter, intake air system for an internal combustion engine, and control system for the same

There is disclosed a thermal-type air flow measuring instrument which judges whether the direction of flow of a fluid, ranging from a static flow to a pulsating flow involving a reverse flow, is forward or reverse, and outputs a signal corresponding to the flow rate of the fluid, thereby measuring the flow rate with high precision. An auxiliary passage is provided in a fluid passage, and is constituted by first, second and third passageways. Two temperature sensing resistors are mounted respectively at an upstream side and a downstream side within the first passageway in close proximity to each other. Most of the fluid, flowed into the first passageway in a forward direction, flows through the second passageway. The third passageway serves to direct a reverse flow of the fluid toward the temperature sensing resistors. Results of measurement of the flow rate of intake air in an internal combustion engine indicate that a minus error due to a pulsating flow, experienced in the conventional construction, is eliminated almost completely, and that a plus error due to a reverse flow is reduced to about 1/10.

Kaoru Uchiyama

Papers

Semiconductor absolute pressure transducer assembly and method

Bump forming method and bump forming apparatus

Module and method for fabricating the same

Thermal-type airflow meter, intake air system for an internal combustion engine, and control system for the same

Thermal-type air flow measuring instrument with fluid-direction judging capability