International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

Review of pool boiling enhancement by surface modification

By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organic compound layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathode, and transmission of the injected electrons can be performed with good efficiency. Further, there are no problems such as excessive energy loss, deterioration of the organic compound layer itself, and the like accompanying electron movement, and therefore an increase in the electron injecting characteristics and a decrease in the driver voltage can both be achieved without depending on the work function of the cathode material.

Light Emitting Device

Numerical study of bubble growth and wall heat transfer during flow boiling in a microchannel

Functionalized interfaces enhancing phase-change processes have immense applicability in thermal management. Here, a methodology for fabrication of surfaces enabling extreme boiling heat transfer performance is demonstrated, combining direct nanosecond laser texturing and chemical vapor deposition of a hydrophobic fluorinated silane. Multiple strategies of laser texturing are explored on aluminum with subsequent nanoscale hydrophobization. Both superhydrophilic and superhydrophobic surfaces with laser-engineered microcavities exhibit significant enhancement of the pool boiling heat transfer. Surfaces with superhydrophobic microcavities allow for enhancements of a heat transfer coefficient of over 500%. Larger microcavities with a mean diameter of 4.2 μm, achieved using equidistant laser scanning separation, induce an early transition into the favorable nucleate boiling regime, while smaller microcavities with a mean diameter of 2.8 μm, achieved using variable separation, provide superior performance at high heat fluxes. The enhanced boiling performance confirms that the Wenzel wetting regime is possible during boiling on apparently superhydrophobic surfaces. A notable critical heat flux enhancement is demonstrated on superhydrophobic surfaces with an engineered microstructure showing definitively the importance and concomitant effect of both the surface wettability and topography for enhanced boiling. The fast, low-cost, and repeatable fabrication process has great potential for advanced thermal management applications.

Laser-Engineered Microcavity Surfaces with a Nanoscale Superhydrophobic Coating for Extreme Boiling Performance

Confinement effects on nucleate boiling and critical heat flux in buoyancy-driven microchannels

A lightguide functioning as a luminaire. The luminaire includes at least one solid state light source, such as an LED, and a lightguide configured to receive light from the solid state light source. Light from the light source is coupled into the lightguide and transported within it by total internal reflection until the light exits the lightguide. A shape of the lightguide causes and directs extraction of the light. The shape can also be used to create a particular pattern of the extracted light.

Lightguide as luminaire

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Cooling the Electronic Brain

Lightguide lighting assembly

Three-dimensional die stacking increases integrated circuit (IC) density, providing increased capabilities and improved electrical performance on a smaller printed circuit board (PCB) footprint area. However, these advantages come at the expense of higher volumetric heat generation rates and decreased thermal and mechanical access to the die areas. Passive immersion cooling, allowing for buoyancy-driven fluid flow between stacked dies, can provide high heat transfer coefficients directly on the die surfaces, can easily accommodate a wide variety of interconnect schemes, and is scalable to any number of dies. A methodology for the optimization of immersion cooled 3-D stacked dies is presented, including the effects of confinement on natural convection and channel boiling. Optimum die spacings for both single and two phase cooling with saturated FC-72 are found to be on the order of half a millimeter for typical microelectronics geometries and to yield heat densities of 10-50 W/cm3 in natural convection and 100-500 W/cm3 in channel boiling.

Karl J. L. Geisler

Papers

Confinement effects on nucleate boiling and critical heat flux in buoyancy-driven microchannels

Lightguide as luminaire

Cooling the Electronic Brain

Lightguide lighting assembly

Passive Immersion Cooling of 3-D Stacked Dies