A review of the composite phase change materials: Fabrication, characterization, mathematical modeling and application to performance enhancement

Thermal management is one of the main challenges for the future of electronics1–5. With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the power density of electronics has risen6. Consequently, cooling, with its enormous energy and water consumption, has an increasingly large environmental impact7,8, and new technologies are needed to extract the heat in a more sustainable way—that is, requiring less water and energy9. Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management5,10,11. However, even in state-of-the-art approaches, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. Here we show that by co-designing microfluidics and electronics within the same semiconductor substrate we can produce a monolithically integrated manifold microchannel cooling structure with efficiency beyond what is currently available. Our results show that heat fluxes exceeding 1.7 kilowatts per square centimetre can be extracted using only 0.57 watts per square centimetre of pumping power. We observed an unprecedented coefficient of performance (exceeding 10,000) for single-phase water-cooling of heat fluxes exceeding 1 kilowatt per square centimetre, corresponding to a 50-fold increase compared to straight microchannels, as well as a very high average Nusselt number of 16. The proposed cooling technology should enable further miniaturization of electronics, potentially extending Moore’s law and greatly reducing the energy consumption in cooling of electronics. Furthermore, by removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip. Cooling efficiency is greatly increased by directly embedding liquid cooling into electronic chips, using microfluidics-based heat sinks that are designed in conjunction with the electronics within the same semiconductor substrate.

/pdf/co-designing-electronics-with-microfluidics-for-more-5aa1udo1ts.pdf

Co-designing electronics with microfluidics for more sustainable cooling.

Generation of 3D representative volume elements for heterogeneous materials: a review

Effective thermal conductivity of open-cell metal foams impregnated with pure paraffin for latent heat storage

Thank you very much for downloading principles of heat transfer in porous media. Maybe you have knowledge that, people have look hundreds times for their chosen books like this principles of heat transfer in porous media, but end up in malicious downloads. Rather than enjoying a good book with a cup of coffee in the afternoon, instead they cope with some harmful bugs inside their desktop computer. principles of heat transfer in porous media is available in our digital library an online access to it is set as public so you can get it instantly. Our book servers saves in multiple locations, allowing you to get the most less latency time to download any of our books like this one. Kindly say, the principles of heat transfer in porous media is universally compatible with any devices to read.

Principles Of Heat Transfer In Porous Media

Important heat transfer parameters of aluminum foams of varying pore sizes are investigated through CT-scanning at 20 micron resolution. Small sub-samples from the resulting images are processed to generate feature-preserving, finite-volume meshes of high quality. All three foam samples exhibit similar volumetric porosity (in the range ∼91–93%), and thereby a similar thermal conductivity. Effective tortuosity for conduction along the coordinate directions is also calculated. Permeability simulations in the Darcy flow regime with air and water show that the foam permeability is isotropic and is of the order of 10−7 m2. The convective heat transfer results computed for this range of Reynolds numbers exhibit a dependence on the linear porosity, even though the corresponding volumetric porosity is the same for all the samples considered.

/pdf/microtomography-based-simulation-of-transport-through-open-2bnvhy27rq.pdf

Microtomography-Based Simulation of Transport through Open-Cell Metal Foams

https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1256&context=coolingpubs

Numerical Investigation of Pressure Drop and Heat Transfer through Reconstructed Metal Foams and Comparison against Experiments

https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1202&context=coolingpubs

Manifold microchannel heat sink design using optimization under uncertainty

https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1190&context=coolingpubs

Evaporation analysis in sintered wick microstructures

https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1218&context=coolingpubs

Karthik K. Bodla

Papers

Microtomography-Based Simulation of Transport through Open-Cell Metal Foams

Numerical Investigation of Pressure Drop and Heat Transfer through Reconstructed Metal Foams and Comparison against Experiments

Manifold microchannel heat sink design using optimization under uncertainty

Evaporation analysis in sintered wick microstructures

3D reconstruction and design of porous media from thin sections