S
Suresh V. Garimella
Researcher at Purdue University
Publications - 566
Citations - 24770
Suresh V. Garimella is an academic researcher from Purdue University. The author has contributed to research in topics: Heat transfer & Heat transfer coefficient. The author has an hindex of 80, co-authored 557 publications receiving 21648 citations. Previous affiliations of Suresh V. Garimella include University of Wisconsin–Milwaukee & Toyota Motor Engineering & Manufacturing North America.
Papers
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Investigation of heat transfer in rectangular microchannels
TL;DR: In this article, an experimental investigation was conducted to explore the validity of classical correlations based on conventionalsized channels for predicting the thermal behavior in single-phase flow through rectangular microchannels.
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Recent advances in microscale pumping technologies: a review and evaluation
TL;DR: Critical selection criteria are included for pumps and valves to aid in determining the pumping mechanism that is most appropriate for a given application and important limitations or incompatibilities are addressed.
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A Comparative Analysis of Studies on Heat Transfer and Fluid Flow in Microchannels
TL;DR: In this paper, a compilation and analysis of the results from investigations on fluid flow and heat transfer in micro- and mini-channels and microtubes in the literature is presented, with a special emphasis on quantitative experimental results and theoretical predictions.
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Thermally Developing Flow and Heat Transfer in Rectangular Microchannels of Different Aspect Ratios
Poh Seng Lee,Suresh V. Garimella +1 more
TL;DR: In this paper, three-dimensional numerical simulations were performed for laminar thermally developing flow in microchannels of different aspect ratios, based on the temperature and heat flux distributions obtained, both the local and average Nusselt numbers were presented graphically as a function of the dimensionless axial distance and channel aspect ratio.
Journal ArticleDOI
Thermal Challenges in Next-Generation Electronic Systems
Suresh V. Garimella,Amy S. Fleischer,Jayathi Y. Murthy,A. Keshavarzi,Ravi Prasher,Chandrakant D. Patel,Sushil H. Bhavnani,Rama Venkatasubramanian,Ravindranath V. Mahajan,Yogendra Joshi,Bahgat Sammakia,B.A. Myers,L. Chorosinski,Martine Baelmans,P. Sathyamurthy,Peter E. Raad +15 more
TL;DR: The thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this article.