The present invention relates to a liquid crystal display and a driving method thereof. A liquid crystal display according to the present invention comprises: a liquid crystal panel assembly (1) including a plurality of gate lines, a plurality of data lines which are insulated from and intersects the gate lines, and a plurality of pixels each of which is formed in an area defined by the data line and the gate line and has a switching element connected to the gate line and the data line; a gate driver (2) for supplying gate voltages to the gate lines; at least one data driver (3) for supplying data voltages corresponding to image data to the data lines; and a timing controller (5) for comparing nth image data applied from outside and (n-1)th image data stored therein and selectively providing the nth image data to the data driver depending on the comparison result. According to the present invention, since image data transmission between the timing controller and the data driver can be minimized, power consumption and EMI due to image data switching can be reduced.

Liquid crystal display and method for driving thereof

First and second electrodes and first and second electrical connection portions are overlapped and electrically connected. A first substrate includes: an attachment portion, a connection portion and an extension portion, the attachment portion being attached to the second substrate, the connection portion being connected to the attachment portion and positioned outside the second substrate, and the extension portion being extending from the connection portion along an edge of the second substrate without overlapping the second substrate. The first electrical connection sections are formed on the extension portion of the first substrate.

Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument

A flat display panel comprises a plurality of driver ICs and one or more flexible printed circuit, a plurality of common wires formed on the substrate to electrically connect the ICs to the one or more flexible printed circuit, and at least one anisotropic conductive film that connects respective connecting terminals of the driver ICs and flexible printed circuit to terminals pads of the common wires. The anisotropic conductive film is laminated over the substrate to cover the terminal pads. The driver ICs and flexible printed circuit are aligned and attached on the anisotropic conductive layer by thermocompression bonding.

Flat display panel and assembly process or driver components in flat display panel

There is provided an imager package including an image sensor die attached to a transparent substrate such that sensitive image sensing components on the sensor die face the transparent substrate. In accordance with an embodiment of the present technique, the imager package may be coupled to an external package via bond wires and other interconnect elements. The sensor die and bond wires may be protected by an encapsulant on which the interconnect elements may be disposed. The bond wires may enable placement of the interconnect elements partially or directly above the sensor die, as opposed to around an outer periphery of the sensor die. There is further provided a method of manufacturing an imager package wherein interconnect elements may be located partially or directly above the sensor die, enabling the manufacture of smaller imager packages than previously envisioned.

Flip-chip image sensor packages and methods of fabricating the same

Methods of manufacturing an imaging device package are provided. In accordance with an embodiment a sensor die may be coupled to bond pads on a transparent substrate. Electrically conductive paths comprising bond wires are formed through the bond pads from the sensor die to an outer surface of the imaging device package.

Methods of manufacturing imaging device packages

A liquid crystal display structure, includes a glass substrate and at least one or more chips mounted on the glass substrate including flexible printed circuit connect pins A common wiring for connecting the at least one or more chips to a flexible printed circuit is formed on the glass substrate The common wiring is connected to the flexible printed circuit connect pins of the at least one or more chips and to the flexible printed circuit at at least one position on the common wiring

Katsurou Hayashi

Papers

Chip-on-glass (COG) structure liquid crystal display (LCD)