A projection exposure apparatus including an irradiation optical system including a light source and irradiating a mask with irradiation light beams, a projection optical system for projecting an image of a pattern of the mask on a substrate, a plurality of first fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed surface with respect to the pattern of the mask in the irradiation optical system or on a plane adjacent to the same and having a center located at a plurality of positions which are eccentric from the optical axis of the irradiation optical system, a plurality of second fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed plane with respect to the incidental end of each of a plurality of the first fly-eye type optical integrators or on a plane adjacent to the same and being disposed to correspond to a plurality of the first fly-eye type optical integrators, and a light divider for dividing and causing the irradiation light beams from the light source to be incident on each of a plurality of the second fly-eye type optical integrators.

Projection exposure apparatus

Lithography is a field in which advances proceed at a swift pace. This book was written to address several needs, and the revisions for the second edition were made with those original objectives in mind. Many new topics have been included in this text commensurate with the progress that has taken place during the past few years, and several subjects are discussed in more detail. This book is intended to serve as an introduction to the science of microlithography for people who are unfamiliar with the subject. Topics directly related to the tools used to manufacture integrated circuits are addressed in depth, including such topics as overlay, the stages of exposure, tools, and light sources. This text also contains numerous references for students who want to investigate particular topics in more detail, and they provide the experienced lithographer with lists of references by topic as well. It is expected that the reader of this book will have a foundation in basic physics and chemistry. No topics will require knowledge of mathematics beyond elementary calculus.

Principles of Lithography

This paper presents a facile synthesis of single-crystalline Au nanowires by reduction of HAuCl4 in oleic acid and oleylamine. The diameter of these micron-meter-long Au nanowires is controlled to be 3 and 9 nm by volume ratio of oleylamine and oleic acid. When linked between two gold electrodes, the 9 nm Au nanowire shows good electron conductivity with its breakdown current density reaching 3.5 × 1012 A/m2. This demonstrates that the chemically made ultrathin Au nanowires can be used as a molecular-scale interconnect for nanoelectronic applications.

http://cml.harvard.edu/assets/JACS_130_8902.pdf

Ultrathin Au nanowires and their transport properties.

A lithographic apparatus configured to project a patterned beam of radiation onto a target portion of a substrate is disclosed. The apparatus includes a first radiation dose detector and a second radiation dose detector, each detector comprising a secondary electron emission surface configured to receive a radiation flux and to emit secondary electrons due to the receipt of the radiation flux, the first radiation dose detector located upstream with respect to the second radiation dose detector viewed with respect to a direction of radiation transmission, and a meter, connected to each detector, to detect a current or voltage resulting from the secondary electron emission from the respective electron emission surface.

Lithographic apparatus, and device manufacturing method

An apparatus for exposing a pattern, formed on a mask, on each of a plurality of partitioned areas on a photosensitive substrate by a step-and-repeat scheme includes a projection optical system for projecting the pattern of the mask on the photosensitive substrate, a substrate stage for holding the photosensitive substrate and two-dimensionally moving the photosensitive substrate within a plane perpendicular to the optical axis of the projection optical system, a detection unit for projecting a pattern image having a predetermined shape on the photosensitive substrate and photoelectrically detecting light reflected by the photosensitive substrate to detect a position at each of a plurality of points on the photosensitive substrate along the optical axis of the projection optical system, and a measurement unit for, when each of a plurality of measurement points in a partitioned area on which a pattern of the mask is to be exposed next coincides with or approaches the pattern image, detecting an offset amount between an imaging plane of the projection optical system and the next partitioned area along the optical axis during a stepping operation of the substrate stage, wherein the imaging plane and the next partitioned area are relatively moved along the optical axis in accordance with the measured offset amount before the pattern of the mask is exposed on the next partitioned area.

Exposure method and apparatus

EXPOSURE SYSTEM System Overview of Optical Steppers and Scanners Michael S. Hibbs Optical Lithography Modeling Chris A. Mack Optics for Photolithography Bruce W. Smith Excimer Laser for Advanced Microlithography Palash Das Alignment and Overlay Gregg M. Gallatin Electron Beam Lithography System Kazuaki Suzuki X-Ray Lithography Takumi Ueno EUV Lithography Stefan Wurm and Charles Gwyn Imprint Lithography Douglas J. Resnick RESISTS AND PROCESSING Chemistry of Photoresist Materials Takumi Ueno and Robert D. Allen Resist Processing Bruce W. Smith Multilayer Resist Technology Bruce W. Smith and Maureen Hanratty Dry Etching of Photoresists Roderick R. Kunz METROLOGY AND NANOLITHOGRAPHY Critical-Dimensional Metrology for Integrated-Circuit Technology Herschel M. Marchman, Gian Lorusso, Mike Adel, and Sanjay Yedur Electron Beam Nanolithography Elizabeth A. Dobisz, Zvonimir Z. Bandic, and Martin C. Peckerar Index

Microlithography : science and technology

A projection optical apparatus for projection an image of an object onto a workpiece, which is suitable for use, for example, as an exposure apparatus used in the manufacture of integrated circuits The projection optical apparatus includes an image forming optical system whose optical characteristic is changed by the light energy supplied from the illuminated object A change of the optical characteristic of the optical system is determined by the use of a predetermined parameter whereby when the distribution of the light energy on the pupil of the optical system is changed, the parameter is correct in such a manner that the change of the optical characteristic determined by the parameter is changed in correspondence to the change in the distribution of the light energy

Projection optical apparatus

A simple illumination control device provides illuminating light with improved uniformity in intensity and without speckle fringes. A speckle pattern, formed with a specific periodicity by the irradiation of a pulse on a first object or a second object, is moved within a predetermined range at least in one direction. The minimum number of pulses required for substantially smoothing the speckle pattern on the second object by irradiation of plural pulses during the movement of the speckle pattern over the predetermined range, is stored. Based on the minimum number of pulses, the number of pulses required for obtaining desired exposure, the amount of light of each pulse, and the number of pulses for moving the speckle pattern substantially by a cycle, are determined.

Exposure control device

An energy amount control device having a pulse energy generating source which produces pulse energy with a predetermined range of energy fluctuations per oscillation, and adjusting voltage applied to the energy generating source to thereby control an energy amount of the pulse energy, the energy amount control device comprising a storage unit for storing information about the relation between predetermined voltage to produce pulse energy in the energy generating source and an energy amount of the pulse energy emitted from the energy generating source under the predetermined voltage; an energy amount measuring unit for detecting the energy amount of the pulse energy actually emitted from the energy generating source; an arithmetic unit for updating the information stored in the storage unit at predetermined timing based on the predetermined voltage to produce the pulse energy in the energy generating source and the energy amount detected by the energy amount measuring unit; and decision unit for determining the predetermined voltage corresponding to the energy amount of the pulse energy to be next emitted, based on the information updated by the arithmetic unit.

Energy amount control device

Projection reduction exposure with variable axis immersion lenses (PREVAIL) represents the high throughput e-beam projection approach to NGL, which IBM is pursuing in cooperation with Nikon as alliance partner; another e-beam projection approach is SCALPEL pursued by Lucent Technologies. This article discusses the challenges and accomplishments of the PREVAIL project. It will focus on the results obtained with the proof of concept (POC) system. This system was developed to demonstrate key technical building blocks required for high throughput, high resolution e-beam step, and scan projection lithography. The supreme challenge facing all e-beam lithography approaches has been and still is throughput. Since the throughput of e-beam projection systems is severely limited by the available optical field size, the key to success is the ability to overcome this limitation. The PREVAIL technique overcomes field-limiting off-axis aberrations through the use of variable axis lenses, which electronically shift the o...

Kazuaki Suzuki

Papers

Microlithography : science and technology

Projection optical apparatus

Exposure control device

Energy amount control device

Projection reduction exposure with variable axis immersion lenses: Next generation lithography