During the last two decades atmospheric (or high) pressure non-thermal plasmas in and in contact with liquids have received a lot of attention in view of their considerable environmental and medical applications. The simultaneous generation of intense UV radiation, shock waves and active radicals makes these discharges particularly suitable for decontamination, sterilization and purification purposes. This paper reviews the current status of research on atmospheric pressure non-thermal discharges in and in contact with liquids. The emphasis is on their generation mechanisms and their physical characteristics.

http://iopscience.iop.org/article/10.1088/0022-3727/42/5/053001/pdf

Non-thermal plasmas in and in contact with liquids

Plasma–liquid interactions represent a growing interdisciplinary area of research involving plasma science, fluid dynamics, heat and mass transfer, photolysis, multiphase chemistry and aerosol science. This review provides an assessment of the state-of-the-art of this multidisciplinary area and identifies the key research challenges. The developments in diagnostics, modeling and further extensions of cross section and reaction rate databases that are necessary to address these challenges are discussed. The review focusses on non-equilibrium plasmas.

/pdf/plasma-liquid-interactions-a-review-and-roadmap-4kfoerpjnh.pdf

Plasma-liquid interactions: A review and roadmap

Advances in soft robotics, materials science, and stretchable electronics have enabled rapid progress in soft grippers. Here, a critical overview of soft robotic grippers is presented, covering different material sets, physical principles, and device architectures. Soft gripping can be categorized into three technologies, enabling grasping by: a) actuation, b) controlled stiffness, and c) controlled adhesion. A comprehensive review of each type is presented. Compared to rigid grippers, end-effectors fabricated from flexible and soft components can often grasp or manipulate a larger variety of objects. Such grippers are an example of morphological computation, where control complexity is greatly reduced by material softness and mechanical compliance. Advanced materials and soft components, in particular silicone elastomers, shape memory materials, and active polymers and gels, are increasingly investigated for the design of lighter, simpler, and more universal grippers, using the inherent functionality of the materials. Embedding stretchable distributed sensors in or on soft grippers greatly enhances the ways in which the grippers interact with objects. Challenges for soft grippers include miniaturization, robustness, speed, integration of sensing, and control. Improved materials, processing methods, and sensing play an important role in future research.

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.201707035

Soft Robotic Grippers.

Mechanical recycling of waste electric and electronic equipment: a review.

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

The applications of the electrostatic separation technique employed in the various field was overviewed. By classifying the electrostatic separators with the charging method and with the kind of sorting equipment, recent progress in the electrostatic separators was presented and also future trend was discussed. Principle and practical structure of the separator employing corona charging and induction charging was described in detail. Basically these charging and separation methods are applied to the materials with large difference in conductivities. Triboelectrification has been employed to charge the materials with little difference in conductivities. This is the case of the separation of reusable plastic material from plastic mixture and of minerals or ash contents from coal powder. Triboelectric charging is a key technique and the variety of a tribocharger for coal cleaning was presented. As an example of a practical separator, recent prominent recycling technology of copper and resin from pri...

Recent progress in electrostatic separation technology

Mechanical holding systems of a wafer might cause serious problems in the semiconductor industry. Electrostatic wafer handling might be one of the possible solutions for such problems. The authors have investigated an attractive force on a silicon wafer by using an electrostatic chuck which consists of interdigitated electrodes and a dielectric thin film. Electrostatic attractive force increases as the applied voltage increases, and with a thinner dielectric layer. With the narrower width and spacing of interdigitated electrodes, the stronger electrostatic force is obtained. When 1-mm width and spacing interdigitated electrodes and 50-/spl mu/m-thick polymer film are used, the strongest force obtained was about 17 N in the vertical direction at 3.5 kV, for a 4-in silicon wafer. When DC high voltage is used, some residual force remains, even after the applied voltage is removed. This was overcome by using variable-frequency AC high voltage.

Fundamental study of an electrostatic chuck for silicon wafer handling

Electrification phenomena of pure water droplets dripping and sliding on a polymer surface

It has been thought that the conductivity of pure water is high enough to neglect the streaming electrification. However, with the advancement of semiconductor industries, even ultrapure water appeared to cause electrification problems at the washing and the rinsing processes of semiconductor wafers. The investigation on the electrification phenomenon of polymer (PTFE) surface with ultrapure water is described in this article. Water droplets are always charged positively after sliding on the PTFE surface, and the surface potential on PTFE is almost negative and varied along the path of droplets becoming positive downstream. As the conductivity of water becomes closer to that of ideal water, the amount of droplet charge increases drastically. This electrification phenomenon is also enhanced by decreasing the thickness of the PTFE plate. It suggests that the Coulomb force between the charge on the PTFE surface and the minor image charge is an important factor. The authors have proposed a model which is based on the electric double layer similar to conventional streaming electrification for insulating liquid, assuming that the charged droplet leaves the excess positive charge on the polymer surface. >

Kazutoshi Asano

Papers

Recent progress in electrostatic separation technology

Fundamental study of an electrostatic chuck for silicon wafer handling

Electrification phenomena of pure water droplets dripping and sliding on a polymer surface

Electrification of polymer surface caused by sliding ultrapure water

Triboelectrification of plastic particles on a vibrating feeder laminated with a plastic film