An internal combustion engine wherein an HC treatment catalyst (12) having the function of adsorbing the HC in the exhaust gas is arranged upstream of the NOx selective reducing catalyst (14), an urea aqueous solution fed from the reducing agent feed valve (15) is arranged upstream of the HC treatment catalyst (12), urea, and NOx contained in the exhaust gas, and HC adsorbed on the HC treatment catalyst 12 are reacted with each other to form intermediate products having cyano groups, oximes, and amino groups, and these intermediate products are sent to the NOx selective reducing catalyst (14).

Exhaust purification device of internal combustion engine

Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Methods and systems for forming a dual layer housing

An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying and in thermal contact with the microprocessor or integrated circuit, is covered by a block of thermally conductive material of predetermined thickness T, where T is a function of a desired temperature profile and, optionally, the current drawn by the microprocessor undergoing testing.

Temperature control of an integrated circuit

The present invention is a boom system comprising a first boom section having a distal end and a proximal end. A second boom section includes a distal end and a proximal end, wherein the proximal end of the second boom section is rotatably coupled to the distal end of the first boom section. At least one of the boom sections is substantially formed from composite materials.

Boom utilizing composite material construction

In one embodiment, a packaged semiconductor device having enhanced thermal dissipation characteristics includes a lead frame structure and a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged semiconductor device further includes a non-planar, stepped or undulating attachment structure coupling the current carrying electrode to the lead frame. A high thermal conductivity mold compound and thin package profile further enhance thermal dissipation.

Semiconductor package structure having enhanced thermal dissipation characteristics

A heat-conductive composite material usable as a substrate (heat sink) for mounting a semiconductor thereon or a lead frame includes which comprises a core sheet and metal foil layers welded to the both surfaces of the core sheet. The core sheet is composed of a metal sheet of high thermal expansion sandwiched between two metal sheets of low thermal expansion, each having a number of through-holes in the direction of the thickness, and the three layers are laminated and integrated so that a part of the metal sheet of high thermal expansion is exposed out to the metal surfaces of low thermal expansion through the through-holes of the metal sheets of low thermal expansion The metal foil layers each are made of a metal of high thermal expansion, which are same as or different from the metal of high thermal expansion of constituting the core sheet. Varying the thickness ratio of the respective constitutional metal sheets and the surface area ratio of the exposed metal spots on the surfaces of the core sheet, heat-conductive composite materials having any desired thermal expansion coefficient and thermal conductivity can be obtained. Additionally, by providing outermost metal foil layers on both surfaces of the core sheet, the heat-conductive composite material has an improved uniform heat-receiving effect and an improved excellent heat-diffusing effect. Further, the material is free from fine pores on the both surfaces thereof and therefore has an excellent weldability.

Heat-conductive composite material

PURPOSE: To obtain a composite material whose coefficient of thermal expansion and heat conductivity can be aribitrarily selected corresponding to a use or purpose by integrating a high thermal expansion metal plate with a low thermal expansion metal plate having a large number of piercing holes in its thickness direction and selecting the thickness ratio of both metal plates and the surface area ratio of the exposed high and low thermal expansion metals. CONSTITUTION: A low thermal expansion metal plate having a large number of piercing holes 13 in its thickness direction, for example, a Kovar plate 12 is integrated with a high thermal expansion metal plate, for example, a copper plate 11 in a pressure contact state and the high thermal expansion metal is exposed to the surface of the low thermal expansion metal plate from the piercing holes 13 and, by appropriately selecting the thickness ratio of both metal plates or the exposed area ratio of these metal plates on a main surface, the coefficient of thermal expansion and heat conductivity can be arbitrarily changed. By rolling the high thermal expansion metal plate 11 and the low thermal expansion metal plate 12 having a large number of the piercing holes 13 in its thickness direction in a pressure contact state, an objective composite material 10 is prepared. COPYRIGHT: (C)1991,JPO&Japio

Composite material variable in coefficient of thermal expansion and heat conductivity

A composite foil brazing material for joining ceramics to each other or to metal, which is made up of a core of Ti and outer layers of Ni or Ni alloy containing less than 80% of Cu, with the core and the composite foil having the respective sectional areas whose ratio is 5/10 to 9/10.

Composite foil brazing material and method of using

PURPOSE: To provide the above composite foil brazing material which has excellent brazing workability and with which high strength of adhesion is obtainable by coating both surfaces of the Zr material which a core material with 3 laminated materials consisting of Cu/Ti/Ni in such a manner that the Ni material is the outermost surface and the sectional area ratios of the respective blank substrates attain specific values. CONSTITUTION: Both surfaces of the Zr material which is the core material are coated and formed with the 3 laminated materials consisting of the Cu/Ti/Ni as a skin material in such a manner that the outermost surface is the Ni material. Further, the materials are so formed that the sectional area ratios of the Cu material, the Ti material and the Ni material attain 30 to 40% Zr material, 35 to 45% %i material, 10 to 25% Cu material and 5 to 10% Ni material, by which the composite foil brazing material for joining ceramics consisting of the 7-layered composite materials is produced. The resulting brazing material is as relatively low as 950°C in brazing working temp. and, therefore, the brazing work and be carried out with good workability. In addition, the easy and excellent adhesion is executed even if the shapes of the joint surfaces of the materials to be joined are intricate. COPYRIGHT: (C)1992,JPO&Japio

Kenji Hirano

Papers

Heat-conductive composite material

Composite material variable in coefficient of thermal expansion and heat conductivity

Composite foil brazing material and method of using

Composite foil brazing material for joining ceramics

Composite foil brazing material