First and second electronic parts interconnected by a nonconductive nanoporous film having first and second parallel surfaces, said film having metal-filled pores extending through the thickness of the film, such that each of said parts is contacted by the metal in at least several pores, a number of the pores being perpendicular to the surfaces of the film, and other pores being oblique to the surfaces of the film, whereby thermal dissipation is enhanced in the plane of the film.

Microelectronic assemblies including Z-axis conductive films

Calorimetric evaluation of phase change materials for use as thermal interface materials

Fluid storage and dispensing systems and processes involving various devices, structures and arrangements, as well as techniques and methods, for fluid storage and dispensing, including, without limitation, pre-connect verification couplings that are usefully employed in application to fluid storage and dispensing packages, to ensure proper coupling and avoid fluid contamination issues, empty detect systems that are usefully employed for fluid storage and dispensing packages incorporating liners that are pressure-compressed in the fluid dispensing operation, ergonomically enhanced structures for facilitating removal of a dispense connector from a capped vessel, cap integrity assurance systems for preventing misuse of vessel caps, and keycoding systems for ensuring coupling of proper dispense assemblies and vessels. Fluid storage and dispensing systems are described, which achieve zero or near-zero headspace character, and prevent or ameliorate solubilization effects in liquid dispensing from liners in overpack vessels.

Fluid storage and dispensing systems and processes

A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a plurality of die pads of an active surface, the semiconductor die being mounted on the device carrier. Connection means to electrically connect the die pads to the contact areas and a heat spreading means mounted on the active surface of the die are provided. The heat spreading means includes an upper plate and a foot ring which protrudes from a bottom surface of the upper plate and which is positioned between the die pads on the active surface such that a cavity is formed between the heat spreading means and the active surface. The cavity is filled with an adhering means interconnecting the heat spreading means and the active surface.

Semiconductor package with heat spreader

Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Methods and systems for forming a dual layer housing

A heat-conductive composite material usable as a substrate (heat sink) for mounting a semiconductor thereon or a lead frame includes which comprises a core sheet and metal foil layers welded to the both surfaces of the core sheet. The core sheet is composed of a metal sheet of high thermal expansion sandwiched between two metal sheets of low thermal expansion, each having a number of through-holes in the direction of the thickness, and the three layers are laminated and integrated so that a part of the metal sheet of high thermal expansion is exposed out to the metal surfaces of low thermal expansion through the through-holes of the metal sheets of low thermal expansion The metal foil layers each are made of a metal of high thermal expansion, which are same as or different from the metal of high thermal expansion of constituting the core sheet. Varying the thickness ratio of the respective constitutional metal sheets and the surface area ratio of the exposed metal spots on the surfaces of the core sheet, heat-conductive composite materials having any desired thermal expansion coefficient and thermal conductivity can be obtained. Additionally, by providing outermost metal foil layers on both surfaces of the core sheet, the heat-conductive composite material has an improved uniform heat-receiving effect and an improved excellent heat-diffusing effect. Further, the material is free from fine pores on the both surfaces thereof and therefore has an excellent weldability.

Heat-conductive composite material

A container does not cause any quality deterioration of high purity chemicals included therein during the storage and transportation thereof and is not easily broken. The container also permits easy and safe discharge of the high purity chemical. The container for a high purity chemical comprises a flexible internal container formed from a polyolefinic high purity resin and a gas-tight, self-supporting external container, which accommodates the internal container, wherein these internal and external containers are joined together in such a manner that the space formed between these two containers are arbitrary closed and opened so as to ensure the communication with the outside, a liquid-discharge pipe provided with a check valve connected to the pipe midway therein is gas-tightly inserted into the internal container down to the bottom thereof and a connector connected to a pressure source is fitted to the external container.

Container for high purity liquid chemicals

This invention provides heat-conductive materials which may receive evenly the heat as applied thereto, which have an improved heat-releasing effect, which are free from fine pores on the surfaces thereof and therefore have excellent adhesiveness to thin films of plating materials or brazing materials, which have excellent compatibility with materials to be applied thereto, such as chips or sealant resins, with respect to the thermal expansion coefficients of them, and have excellent thermal conductivity, and which may have any desired thermal expansion coefficient and thermal conductivity in accordance with the use and object of them. It also provides methods of producing the heat-conductive materials. One aspect of the heat-conductive materials is such that a two-layer sheet or three-layer sheet to be formed by previously welding under pressure a copper foil to one surface or both surfaces of a Kovar sheet followed by forming a number of small through-holes through the sheet has been welded under pressure to and integrated with one surface or both surfaces of a copper sheet as previously heated up to a temperature not lower than the recrystallizing temperature thereof with a heating device. Another aspect of them is such that a copper sheet as previously heated up to a temperature not lower than the recrystallizing temperature thereof has been welded under pressure to the lower surface of a Kovar sheet having a number of small through-holes therethrough, with a welding machine, and additionally another copper sheet has been welded under pressure to the upper surface of the same with a welding machine, all the welded sheets having been integrated together. Still another aspect of them is such that the materials of the first aspect and/or the second aspect have been laminated and integrated together. The heat-conductive materials of all the aspects have a high welding strength even though the welding of the constitutive sheets is effected at a small reduction ratio, and they may have determined thermal expansion coefficient and thermal conductivity without fluctuating the previously determined ratio of the copper exposing surface areas (through-hole areas) to the Kovar surface.

Heat-conductive material and method of producing the same

PURPOSE: To obtain a composite material whose coefficient of thermal expansion and heat conductivity can be aribitrarily selected corresponding to a use or purpose by integrating a high thermal expansion metal plate with a low thermal expansion metal plate having a large number of piercing holes in its thickness direction and selecting the thickness ratio of both metal plates and the surface area ratio of the exposed high and low thermal expansion metals. CONSTITUTION: A low thermal expansion metal plate having a large number of piercing holes 13 in its thickness direction, for example, a Kovar plate 12 is integrated with a high thermal expansion metal plate, for example, a copper plate 11 in a pressure contact state and the high thermal expansion metal is exposed to the surface of the low thermal expansion metal plate from the piercing holes 13 and, by appropriately selecting the thickness ratio of both metal plates or the exposed area ratio of these metal plates on a main surface, the coefficient of thermal expansion and heat conductivity can be arbitrarily changed. By rolling the high thermal expansion metal plate 11 and the low thermal expansion metal plate 12 having a large number of the piercing holes 13 in its thickness direction in a pressure contact state, an objective composite material 10 is prepared. COPYRIGHT: (C)1991,JPO&Japio

Composite material variable in coefficient of thermal expansion and heat conductivity

A clad sheet (1) comprising a metal substrate (2) and at least one metal cladding layer (3) laminated on at least one surface of said substrate or an intermediate cladding layer, wherein said cladding layer-laminated surface of said substrate and/or at least one of the cladding layers includes a hardened layer portion (2h) formed by melting and rapid solidification through laser beam irradiation Lamination is made by cold-cladding layer elements after irradiating any one of layer elements with laser beam to produce strong bonding through uniform microcrack formed in the hardened layer portion of several micrometers thick. The clad sheets (1) are useful for making IC lead frames, for which the substrate is conductor metal and the cladding layer (3) is solder applied to partial area of the substrate. The irradiation and cladding process is carried out continuously with a reduced draft.

Yasuyuki Nakamura

Papers

Heat-conductive composite material

Container for high purity liquid chemicals

Heat-conductive material and method of producing the same

Composite material variable in coefficient of thermal expansion and heat conductivity

Clad sheet and process and apparatus for producing same