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Showing papers by "Kevin D. Leedy published in 2003"


Journal ArticleDOI
TL;DR: In this article, a 1 μm thick evaporated Au film was used for all bridge materials with additional 20 nm layers of evaporated or sputter deposited Ti, Pt, W or Au on the top or bottom surface of the thick Au.
Abstract: A series of surface micromachined microelectromechanical system switches with composite metal beams were fabricated by standard photolithographic techniques. The study was conducted in order to assess the influence of film stress and composition on the released shape of cantilever and fixed-fixed beam structures. A 1 μm thick evaporated Au film was the basis for all bridge materials with additional 20 nm layers of evaporated or sputter deposited Ti, Pt, W, or Au on the top or bottom surface of the thick Au. The planarity and stress gradient of cantilever beam structures and the planarity of fixed-fixed beam structures were measured by optical interferometry. Gold-only bridge structures displayed the best planarity of those examined while structures with Ti layers displayed the least planarity. Cantilever stress gradients calculated using both cantilever-tip deflection and radius of curvature techniques were typically between 9 and 16 MPa/μm. The thin film biaxial moduli used in stress gradient calculation...

10 citations