Microwave photonics, which brings together the worlds of radiofrequency engineering and optoelectronics, has attracted great interest from both the research community and the commercial sector over the past 30 years and is set to have a bright future. The technology makes it possible to have functions in microwave systems that are complex or even not directly possible in the radiofrequency domain and also creates new opportunities for telecommunication networks. Here we introduce the technology to the photonics community and summarize recent research and important applications.

Microwave photonics combines two worlds

A software radio is defined as a set of digital signal processing (DSP) primitives, a metalevel system for combining the primitives into communication system functions (transmitter, channel model, receiver, etc.), and a set of target processors on which the software radio is hosted for real-time communications. The performance of enabling hardware technologies is related to software radio requirements, portending a decade of shift from hardware radios toward software intensive approaches. Computational models and architecture are discussed, stressing the need for topological consistency of radio functions and host architectures. A layered topology-oriented design approach encapsulated in a canonical open architecture software radio model is presented. The model provides a unified mathematical framework for quantitative analysis of algorithm structures, host architectures, and system performance for CAD. >

Software radios: Survey, critical evaluation and future directions

A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

100-Gb/s dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are demonstrated. The transmitter is realized through the integration of over 50 discrete functions onto a single monolithic InP chip. The resultant DWDM PICs are capable of simultaneously transmitting and receiving ten wavelengths at 10 Gb/s on a DWDM wavelength grid. Optical system performance results across a representative DWDM long-haul link are presented for a next-generation optical transport system using these large-scale PICs. The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption.

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Large-scale photonic integrated circuits

The unitraveling-carrier photodiode (UTC-PD) is a novel photodiode that utilizes only electrons as the active carriers. This unique feature is the key for its ability to achieve excellent high-speed and high-output characteristics simultaneously. To date, a record 3-dB bandwidth of 310 GHz and a millimeter-wave output power of over 20 mW at 100 GHz have been achieved. The superior capability of the UTC-PD for generating very large high-bit-rate electrical signals as well as a very high RF output power in millimeter/submillimeter ranges can lead to innovations in various systems, such as broadband optical communications systems, wireless communications systems, and high-frequency measurement systems. Accomplishments include photoreceivers of up to 160 Gb/s, error-free DEMUX operations using an integrated UTC-PD driven optical gate of up to 320 Gb/s, a 10-Gb/s millimeter-wave wireless link at 120 GHz, submillimeter-wave generation at frequencies of up to 1.5 THz, and photonic frequency conversion with an efficiency of -8 dB at 60 GHz. For the practical use, various types of modules, such as a 1-mm coaxial connector module, a rectangular-waveguide output module, and a quasi-optic module, have been developed. The superior reliability and stability are also confirmed demonstrating usefulness of the UTC-PD for the system applications.

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High-speed and high-output InP-InGaAs unitraveling-carrier photodiodes

The GaAs nonlinear transmission line (NLTL) is a monolithic millimeter-wave integrated circuit consisting of a high-impedance transmission line loaded by reverse-biased Schottky contacts. The engineering of functional monolithic NLTLs is considered. Through generation of shock waves on the NLTL, the authors have generated electrical step functions with approximately 5 V magnitude and less than 1.4 ps fall time. Diode sampling bridges strobed by NLTL shock-wave generators have attained bandwidths approaching 300 GHz and have applications in instruments for millimeter-wave waveform and network measurements. The authors discuss the circuit design and diode design requirements for picosecond NLTL shock-wave generators and NLTL-driven sampling circuits. >

GaAs nonlinear transmission lines for picosecond pulse generation and millimeter-wave sampling

The authors propose and analyze the traveling-wave photodetector (TWPD), an edge-coupled photodetector that is capable of both a larger absolute bandwidth and a larger bandwidth-efficiency product than the waveguide photodetector (WGPD). The intrinsic RC bandwidth limitation is increased in the traveling-wave photodetector by providing for controlled transmission of the electrical wave down the device in parallel with the optical wave and by eliminating bandwidth-limiting electrical reflections. It is shown that 1- mu m wide, parallel-plate, GaAs/AlGaAs, p-i-n TWPD with open-circuit input termination has a 26% greater potential bandwidth-efficiency product than the comparable WGPD, while a TWPD with matched input termination actually has a worse bandwidth-efficiency product than the WGPD. >

Traveling-wave photodetectors

Results of the first fabrication and measurement of travelling-wave photodetectors are reported. The devices have bandwidths as high as 172 GHz, the highest reported for a p-i-n photodetector, and bandwidth-efficiency products as large as 76 GHz, the largest reported for any photodetector without gain. Comparisons with vertically illuminated and waveguide photodetectors fabricated on the same wafer establish the superior performance of travelling-wave photodetectors. Microwave loss on the travelling-wave photodetector structure is identified as a bandwidth limitation. >

Travelling-wave photodetectors with 172-GHz bandwidth and 76-GHz bandwidth-efficiency product

Photodetector efficiency decreases as bandwidth increases, Bandwidth-efficiency limitations of traveling-wave photodetectors (TWPDs) are substantially greater than those of lumped-element photodetectors because the velocity-mismatch bandwidth limitation is independent of device length. TWPDs can be long for high efficiency without significantly compromising bandwidth. The TWPD is modeled by a terminated section of transmission line with a position-dependent photocurrent source propagating on it at the optical group velocity. A wave model for the transmission line confirms the accuracy of an equivalent-circuit model for electrical wave propagation. The velocity-mismatch impulse and frequency response are determined by absorption coefficient and wave velocities rather than junction capacitance and load resistance. The velocity-mismatch bandwidth limitations can be written in a simple form which elucidates the factors affecting device response, A discretized periodic TWPD is described by the same equations as the fully distributed version. This more complicated device offers additional degrees of freedom in design and potentially improved performance.

Traveling-wave photodetector theory

An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.

Kirk S. Giboney

Papers

GaAs nonlinear transmission lines for picosecond pulse generation and millimeter-wave sampling

Traveling-wave photodetectors

Travelling-wave photodetectors with 172-GHz bandwidth and 76-GHz bandwidth-efficiency product

Traveling-wave photodetector theory

Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers