K
Kwang-Lung Lin
Researcher at National Cheng Kung University
Publications - 263
Citations - 4187
Kwang-Lung Lin is an academic researcher from National Cheng Kung University. The author has contributed to research in topics: Intermetallic & Soldering. The author has an hindex of 33, co-authored 256 publications receiving 3851 citations. Previous affiliations of Kwang-Lung Lin include Industrial Technology Research Institute.
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Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
TL;DR: In this paper, the effect of microelements (Ni and Ge) on the interfacial reaction between the solder and the Cu substrate was explored and the results of energy dispersive spectroscopy (EDS) analysis showed that the major interfacial intermetallic formed with the Sn-3.5Ag-0.07Ni solders is Cu6Sn5, while it is (Cux,Ni1−x)6sn5 with Sn- 3.7Cu solder.
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The interaction kinetics and compound formation between electroless NiP and solder
Chwan-Ying Lee,Kwang-Lung Lin +1 more
TL;DR: In this paper, the interdiffusion between an electroless NiP deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed.
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High-Temperature Oxidation of a Sn-Zn-Al Solder
Kwang-Lung Lin,Tzy-Ping Liu +1 more
TL;DR: In this article, the oxidation behavior of 63Sn-37Pb, 91Sn-9Zn, 99.4Sn-0.6Al, and Sn was also investigated for comparison.
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Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps
Kwang-Lung Lin,Yi-Cheng Liu +1 more
TL;DR: In this article, a process for manufacturing Cu/electroless Ni/Sn-Pb solder bump is discussed and an attempt to replace zincation with a Cu film as an active layer for the electroless Ni (EN) deposition on Al electrode on Si wafer is presented.
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The microstructure and property variations of metals induced by electric current treatment: A review
Chien Lung Liang,Kwang-Lung Lin +1 more
TL;DR: In this paper, the authors reviewed the practices of electric current treatment, microstructure-property variations and the physical metallurgy involved in a variety of metals, and showed that an appropriate manipulation of the current treatment enables the control of both thermal and athermal effects.