Printed circuit board

The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Printed circuit board and manufacturing method thereof

To provide a wavelength multiplexing on-chip optical interconnection circuit, an electro-optical device, and an electronic apparatus, wherein a signal transmission speed can be enhanced, fineness can be easily accomplished, and they can be simply manufactured, the wavelength multiplexing on-chip optical interconnection circuit includes a plurality of circuit blocks provided on one integrated circuit chip; and an optical waveguide provided on the integrated circuit chip, as a transmission line to transmit a plurality of light components having different wavelengths λ1 and λ2 between the circuit blocks.

Wavelength multiplexing on-chip optical interconnection circuit, electro-optical device, and electronic apparatus

An electronic package of the kind having a folded substrate is provided. The substrate is configured so that a stress concentration is created where folding is desired. In the present example, the stress concentration is created with first a resilient metal ground layer that resists bending and has an edge that promotes the creation of a stress concentration in a flexible layer at or near the edge. A second metal ground layer resists bending in another portion of the substrate, and also has an edge creating a stress concentration in a different area of the flexible layer. The portions of the substrate having the first and second resilient metal ground layers can be folded over one another with substantially no bending in these portions, while a fold portion between the edges bends to allow for folding of the substrate.

Electronic package having a folded package substrate

A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical transmission line.

Photoelectric composite interconnection assembly and electronics device using same

A flexible electronic/optical interconnection film assembly which includes a flexible waveguide film laminated to a flexible electrical film, such as a flexible PCB. The flexible waveguide film has embedded internal waveguide capable of total internal reflection such that optical transmission between two IC elements can be achieved through the use of laser diode transmitters and photodetector receivers. A flexible electrical film that is laminated to the flexible waveguide film may have a plurality of metal interconnect lines formed therein for providing electrical communication. A thin metal trace layer and a plurality of conductive pads which are formed from the thin metal trace layer may be formed on top of the flexible waveguide film for providing electrical communication with active opto-electronic devices mounted on top of the flexible waveguide film.

Flexible electronic/optical interconnection film assembly and method for manufacturing

There is provided a flexible electronic-optical transmission bus which constructs a flexible light wave-guide and an electrical bus together to transmit high speed signal and low speed signal at the same time, wherein the low speed signal is transmitted by the electrical bus and the high speed signal is de-serialize by a signal de-serializing/serializing device into a transmitting signal and a receiving signal. The transmitting signal is converted by an electronic-optical transmitter into light transmitting signal for being transmitted by the light wave-guide to an electronic-optical receiver at another end and converted back into electrical signal. Furthermore, the transmitting signal and receiving signal are serialized by another de-serializing/serializing device into the same electronic transmission channel.

Lee-Cheng Shen

Papers

Flexible electronic/optical interconnection film assembly and method for manufacturing

Flexible electronic-optical transmission bus