An embodiment includes an integrated circuit comprising a standard cell, the standard cell comprising: first and second active regions having different conductivity types and extending in a first direction; first, second, and third conductive lines extending over the first and second active regions in a second direction substantially perpendicular to the first direction, and disposed parallel to each other; and a cutting layer extending in the first direction between the first and second active regions and separating the first conductive line into a first upper conductive line and a first lower conductive line, the second conductive line into a second upper conductive line and a second lower conductive line, and the third conductive line into a third upper conductive line and a third lower conductive line; wherein: the first upper conductive line and the third lower conductive line are electrically connected together; and the second upper conductive line and the second lower conductive line are electrically connected together.

Integrated circuit and semiconductor device

An electronic circuit includes a first flip-flop, a second flip-flop, and a clock generator. The first flip-flop comprises a first master latch and a first slave latch arranged in order along a first direction. The second flip-flop comprises a second master latch and a second slave latch arranged in order along a second direction that is opposite to the first direction. The clock generator is arranged between the first master latch and the second master latch and outputs a clock.

Electronic circuit including flip-flop using common clock

Disclosed are a semiconductor device and a method of manufacturing the same. The semiconductor device includes first and second logic cells adjacent to each other in a first direction on a substrate, a gate electrode extending in the first direction in each of the first and second logic cells, a power line extending in a second direction at a boundary between the first and second logic cells, and a connection structure electrically connecting the power line to an active pattern of the first logic cell and to an active pattern of the second logic cell. The connection structure lies below the power line and extends from the first logic cell to the second logic cell. A top surface of the connection structure is at a higher level than that of a top surface of the gate electrode.

Semiconductor device having shared power line connections and method of manufacturing the same

To improve space efficiency, a scan flip flop according to the present disclosure includes: an input part which selects any one of a data input signal and a scan input signal according to an operation mode and provides it as an internal signal; and a flip flop which has a cross couple structure which includes a first and a second tri-state inverters sharing a first output node and facing each other, and latches the internal signal according to a clock signal.

Lee Dal Hee

Papers

Scan flop flop and scan test circuit including the scan flip flip