Non-volatile memory devices are so named because they retain information when power is interrupted; thus they are important computer components. In this context, there has been considerable recent interest1,2 in developing non-volatile memories that use ferroelectric thin films—‘ferroelectric random access memories’, or FRAMs—in which information is stored in the polarization state of the ferroelectric material. To realize a practical FRAM, the thin films should satisfy the following criteria: compatibility with existing dynamic random access memory technologies, large remnant polarization (Pr) and reliable polarization-cycling characteristics. Early work focused on lead zirconate titanate (PZT) but, when films of this material were grown on metal electrodes, they generally suffered from a reduction of Pr (‘fatigue’) with polarity switching. Strontium bismuth tantalate (SBT) and related oxides have been proposed to overcome the fatigue problem3, but such materials have other shortcomings, such as a high deposition temperature. Here we show that lanthanum-substituted bismuth titanate thin films provide a promising alternative for FRAM applications. The films are fatigue-free on metal electrodes, they can be deposited at temperatures of ∼650 °C and their values of Pr are larger than those of the SBT films.

Lanthanum-substituted bismuth titanate for use in non-volatile memories

An overview of the state of art in ferroelectric thin films is presented. First, we review applications: microsystems' applications, applications in high frequency electronics, and memories based on ferroelectric materials. The second section deals with materials, structure (domains, in particular), and size effects. Properties of thin films that are important for applications are then addressed: polarization reversal and properties related to the reliability of ferroelectric memories, piezoelectric nonlinearity of ferroelectric films which is relevant to microsystems' applications, and permittivity and loss in ferroelectric films-important in all applications and essential in high frequency devices. In the context of properties we also discuss nanoscale probing of ferroelectrics. Finally, we comment on two important emerging topics: multiferroic materials and ferroelectric one-dimensional nanostructures. (c) 2006 American Institute of Physics.

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Ferroelectric thin films: Review of materials, properties, and applications

The broad spectrum of electronic and optical properties exhibited by oxides offers tremendous opportunities for microelectronic devices, especially when a combination of properties in a single device is desired Here we describe the use of reactive molecular-beam epitaxy and pulsed-laser deposition to synthesize functional oxides, including ferroelectrics, ferromagnets, and materials that are both at the same time Owing to the dependence of properties on direction, it is often optimal to grow functional oxides in particular directions to maximize their properties for a specific application But these thin film techniques offer more than orientation control; customization of the film structure down to the atomic-layer level is possible Numerous examples of the controlled epitaxial growth of oxides with perovskite and perovskite-related structures, including superlattices and metastable phases, are shown In addition to integrating functional oxides with conventional semiconductors, standard semiconductor practices involving epitaxial strain, confined thickness, and modulation doping can also be applied to oxide thin films Results of fundamental scientific importance as well as results revealing the tremendous potential of utilizing functional oxide thin films to create devices with enhanced performance are described

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A Thin Film Approach to Engineering Functionality into Oxides

Piezoelectric materials have been integrated with silicon microelectromechanical systems (MEMS) in both microsensor and microactuator applications. Thin-film materials selection and processing routes are reviewed. Some recent and emerging applications of piezoelectric MEMS are presented including acoustic emission microsensors, vibration monitors, molecular recognition biosensors, precision positioners, micropumps, and linear stepper motors.

Processing and characterization of piezoelectric materials and integration into microelectromechanical systems

Metalorganic chemical vapour deposition (MOCVD) is a highly promising technique for the deposition of dielectric and ferroelectric oxide thin films such as TiO2, ZrO2, HfO2, Pb(Zr,Ti)O3, SrBi2Ta2O9 and Pb(Sc0.5Ta0.5)O3 which have a variety of applications in electronic devices. A key requirement in this technology is the availability of precursors with appropriate physical properties and decomposition characteristics, but there are problems associated with many of the existing precursors. Therefore, in order to exploit the full potential of MOCVD it is sometimes necessary to “tailor” the properties of the precursor in order to optimise process parameters such as evaporation temperature, deposition temperature, layer purity and uniformity. In this paper the molecular design of a number of new oxide precursors is described, illustrating
how the replacement of simple alkoxide groups by other groups, such as donor-functionalised alkoxide or β-diketonate ligands, can result in precursors with improved physical properties and enhanced MOCVD performance.

Molecular design of improved precursors for the MOCVD of electroceramic oxides

A nonconventional way of producing nonvolatile memories is to use ferroelectrics, a class of electroceramic materials. These materials have a remanent polarization. The direction of this polarization can be changed by an electric field. Ferroelectric materials possess a “natural memory,” so to speak. Ferroelectrics have been known for a long time, and the idea to use them for binary data storage originates in the 1950s. The basic element of this type of memory is formed by a ferroelectric capacitor—a ferroelectric layer sandwiched between electrodes. Early prototypes were unsuccessful because rather high voltages were needed to switch the ferroelectric capacitor (200–300 V) and the memories suffered from crosstalk. (Programming one particular cell influenced neighboring cells.) The revival of ferroelectric memories was driven by the development of thin-film deposition techniques that allowed the formation of capacitors with ferroelectric thin films of submicron thicknesses. These capacitors can be switched with normal intergrated-circuit (IC) voltages. The crosstalk problem is circumvented by isolating each memory cell by a transistor (similar to a dynamic random-access memory [DRAM]). Compared to “standard” nonvolatile memories, ferroelectric memories offer the advantage of very fast access times (both for reading and writing), low-voltage operation, and good write/read endurance. A ferroelectric material that is already being used in commercially available memories is lead zirconate titanate, PbZrxTi 1−xO3. To combine a ferroelectric material with IC technology is a challenge, and many problems have been (and will be) encountered.

M. de Keijser

Papers

Chemical Vapor Deposition of Electroceramic Thin Films