The present paper reviews the results of experimental investigations of the photodoping of amorphous chalcogenides by metals, and in particular by silver. The kinetics of the photodissolution of the metal are described as also is the influence on the photodissolution rate of such factors as the wavelength and intensity of light, the composition and temperature of the semiconductor, and an external electric field. A separate section describes lateral diffusion. The properties of photodoped semiconductors (electrical, optical, photoelectric, etc.) are presented. The results in the literature are analysed, giving answers to such fundamental questions as the following. Where is the actinic light which is efficient for the photodissolution absorbed? Which is the diffusion-limiting step? What is the state of the diffusing species (neutral atoms or ions)? The dissolution of silver induced by electron or ion beams and the photodissolution of group II metals are mentioned. The experimental results are fol...

Photodoping of amorphous chalcogenides by metals

Methods of forming metal-doped chalcogenide layers and devices containing such doped chalcogenide layers include using a plasma to induce diffusion of metal into a chalcogenide layer concurrently with metal deposition. The plasma contains at least one noble gas of low atomic weight, such as neon or helium. The plasma has a sputter yield sufficient to sputter a metal target and a UV component of its emitted spectrum sufficient to induce diffusion of the sputtered metal into the chalcogenide layer. Using such methods, a conductive layer can be formed on the doped chalcogenide layer in situ. In integrated circuit devices, such as non-volatile chalcogenide memory devices, doping of the chalcogenide layer concurrently with metal deposition and formation of a conductive layer in situ with the doping of the chalcogenide layer reduces contamination concerns and physical damage resulting from moving the device substrate from tool to tool, thus facilitating improved device reliability.

Integrated circuit device and fabrication using metal-doped chalcogenide materials

An inverted PCRAM cell is formed by plating the bottom electrode, made of copper for example, with a conductive material, such as silver. Chalcogenide material is disposed over the plated electrode and subjected to a conversion process so that ions from the plated material diffuse into the chalcogenide material.

PCRAM memory cell and method of making same

A method and apparatus is disclosed for sensing the resistance state of a Programmable Conductor Random Access Memory (PCRAM) element using complementary PCRAM elements, one holding the resistance state being sensed and the other holding a complementary resistance state. A sense amplifier detects voltages discharging through the high and low resistance elements to determine the resistance state of an element being read.

Complementary bit PCRAM sense amplifier and method of operation

Two PCRAM cells which use a common anode between them are disclosed. The two memory cells can be accessed separately to store two bits of data which can be read and written, and can be stacked one over the other with a common anode between them to form an upper and lower cell pair. Respective access transistors are provided for the cells and arranged to permit reading and writing of the cells.

M. Morisue

Papers

High speed memory behavior and reliability of an amorphous As2S3 film doped with Ag