Review of Heat Transfer Technologies in Electronic Equipment

Three dimensional numerical analysis of natural convection cooling with an array of discrete heaters embedded in nanofluid filled enclosure

Heat transfer—a review of 1994 literature

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

Single-phase thermosyphon cooling of an array of discrete heat sources in a rectangular cavity

An experimental investigation of natural convection liquid immersion cooling of a three by three array of rectangular protrusions in an enclosure is presented. The heated elements geometrically simulated 20 pin dual-inline electronic packages and were mounted on a plexiglass substrate, which formed one vertical wall of a dielectric liquid filled rectangular enclosure. The remaining vertical boundaries of the enclosure were insulated, while the top and bottom were maintained at prescribed temperatures using individual heat exchanger plates. Protrusion surface temperatures in steady state are reported for a range of power dissipation levels for three fluorinert liquids spanning a Prandtl number range from about 20 to 1400. The influence of enclosure top and bottom surface boundary conditions and its width on element temperatures is investigated. Non-dimensional heat transfer results are empirically correlated. Changes in component temperatures due to partial powering of the array are also measured.

M. Powell

Papers

Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid