Carrier concentration profiles of two-dimensional electron gases are investigated in wurtzite, Ga-face AlxGa1−xN/GaN/AlxGa1−xN and N-face GaN/AlxGa1−xN/GaN heterostructures used for the fabrication of field effect transistors. Analysis of the measured electron distributions in heterostructures with AlGaN barrier layers of different Al concentrations (0.15<x<0.5) and thickness between 20 and 65 nm demonstrate the important role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces. Characterization of the electrical properties of nominally undoped transistor structures reveals the presence of high sheet carrier concentrations, increasing from 6×1012 to 2×1013 cm−2 in the GaN channel with increasing Al-concentration from x=0.15 to 0.31. The observed high sheet carrier concentrations and strong confinement at specific interfaces of the N- and Ga-face pseudomorphic grown heterostructures can be explained as a consequence of interface charges induced by ...

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Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AlGaN/GaN heterostructures

The macroscopic nonlinear pyroelectric polarization of wurtzite AlxGa1-xN, InxGa1-xN and AlxIn1-xN ternary compounds (large spontaneous polarization and piezoelectric coupling) dramatically affects the optical and electrical properties of multilayered Al(In)GaN/GaN hetero-, nanostructures and devices, due to the huge built-in electrostatic fields and bound interface charges caused by gradients in polarization at surfaces and heterointerfaces. Models of polarization-induced effects in GaN-based devices so far have assumed that polarization in ternary nitride alloys can be calculated by a linear interpolation between the limiting values of the binary compounds. We present theoretical and experimental evidence that the macroscopic polarization in nitride alloys is a nonlinear function of strain and composition. We have applied these results to interpret experimental data obtained in a number of InGaN/GaN quantum wells?(QWs) as well as AlInN/GaN and AlGaN/GaN transistor structures. We find that the discrepancies between experiment and ab initio theory present so far are almost completely eliminated for the AlGaN/GaN-based heterostructures when the nonlinearity of polarization is accounted for. The realization of undoped lattice-matched AlInN/GaN heterostructures further allows us to prove the existence of a gradient in spontaneous polarization by the experimental observation of two-dimensional electron gases?(2DEGs). The confinement of 2DEGs in InGaN/GaN QWs in combination with the measured Stark shift of excitonic recombination is used to determine the polarization-induced electric fields in nanostructures. To facilitate inclusion of the predicted nonlinear polarization in future simulations, we give an explicit prescription to calculate polarization-induced electric fields and bound interface charges for arbitrary composition in each of the ternary III-N alloys. In addition, the theoretical and experimental results presented here allow a detailed comparison of the predicted electric fields and bound interface charges with the measured Stark shift and the sheet carrier concentration of polarization-induced 2DEGs. This comparison provides an insight into the reliability of the calculated nonlinear piezoelectric and spontaneous polarization of group III nitride ternary alloys.

http://iopscience.iop.org/article/10.1088/0953-8984/14/13/302/pdf

Pyroelectric properties of Al(In)GaN/GaN hetero- and quantum well structures

During the last few years the interest in the indium nitride (InN) semiconductor has been remarkable. There have been significant improvements in the growth of InN films. High quality single crystalline InN film with two-dimensional growth and high growth rate are now routinely obtained. The background carrier concentration and Hall mobility have also improved. Observation of strong photoluminescence near the band edge is reported very recently, leading to conflicts concerning the exact band gap of InN. Attempts have also been made on the deposition of InN based heterostructures for the fabrication of InN based electronic devices. Preliminary evidence of two-dimensional electron gas accumulation in the InN and studies on InN-based field-effect transistor structure are reported. In this article, the work accomplished in the InN research, from its evolution to till now, is reviewed. The In containing alloys or other nitrides (AlGaInN, GaN,AlN) are not discussed here. We mainly concentrate on the growth, characterization, and recent developments in InN research. The most popular growth techniques, metalorganic vapor phase epitaxy and molecular beam epitaxy, are discussed in detail with their recent progress. Important phenomena in the epitaxialgrowth of InN as well as the problems remaining for future study are also discussed.

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Indium nitride (InN): A review on growth, characterization, and properties

In this review, the structural, mechanical, thermal, and chemical properties of substrates used for gallium nitride (GaN) epitaxy are compiled, and the properties of GaN films deposited on these substrates are reviewed. Among semiconductors, GaN is unique; most of its applications uses thin GaN films deposited on foreign substrates (materials other than GaN); that is, heteroepitaxial thin films. As a consequence of heteroepitaxy, the quality of the GaN films is very dependent on the properties of the substrate—both the inherent properties such as lattice constants and thermal expansion coefficients, and process induced properties such as surface roughness, step height and terrace width, and wetting behavior. The consequences of heteroepitaxy are discussed, including the crystallographic orientation and polarity, surface morphology, and inherent and thermally induced stress in the GaN films. Defects such as threading dislocations, inversion domains, and the unintentional incorporation of impurities into the epitaxial GaN layer resulting from heteroepitaxy are presented along with their effect on device processing and performance. A summary of the structure and lattice constants for many semiconductors, metals, metal nitrides, and oxides used or considered for GaN epitaxy is presented. The properties, synthesis, advantages and disadvantages of the six most commonly employed substrates (sapphire, 6H-SiC, Si, GaAs, LiGaO 2 , and AlN) are presented. Useful substrate properties such as lattice constants, defect densities, elastic moduli, thermal expansion coefficients, thermal conductivities, etching characteristics, and reactivities under deposition conditions are presented. Efforts to reduce the defect densities and to optimize the electrical and optical properties of the GaN epitaxial film by substrate etching, nitridation, and slight misorientation from the (0 0 0 1) crystal plane are reviewed. The requirements, the obstacles, and the results to date to produce zincblende GaN on 3C-SiC/Si(0 0 1) and GaAs are discussed. Tables summarizing measures of the GaN quality such as XRD rocking curve FWHM, photoluminescence peak position and FWHM, and electron mobilities for GaN epitaxial layers produced by MOCVD, MBE, and HVPE for each substrate are given. The initial results using GaN substrates, prepared as bulk crystals and as free-standing epitaxial films, are reviewed. Finally, the promise and the directions of research on new potential substrates, such as compliant and porous substrates are described.

Substrates for gallium nitride epitaxy

The wet etching of GaN, AlN, and SiC is reviewed including conventional etching in aqueous solutions, electrochemical etching in electrolytes and defect-selective chemical etching in molten salts. The mechanism of each etching process is discussed. Etching parameters leading to highly anisotropic etching, dopant-type/bandgap selective etching, defect-selective etching, as well as isotropic etching are discussed. The etch pit shapes and their origins are discussed. The applications of wet etching techniques to characterize crystal polarity and defect density/distribution are reviewed. Additional applications of wet etching for device fabrication, such as producing crystallographic etch profiles, are also reviewed.

Wet etching of GaN, AlN, and SiC : a review

The polarity is found to be a key parameter for the growth of high quality epitaxial GaN films on sapphire (00.1) substrates. A model is suggested which may consistently explain the observed influence of the process parameters on the polar orientation of the epitaxial film. A simple etching technique is proposed for quick distinction of the film polarity. The assignment of the etching behavior to the proper crystal structure is achieved by an analysis of the respective two-dimensional photoelectron diffraction patterns.

Polarity of (00.1) GaN epilayers grown on a (00.1) sapphire

In order to resolve any doubt in lattice polarity calibrations, a given undoped GaN layer deposited on (0001) sapphire by metalorganic chemical vapor deposition and a given high-pressure-grown GaN single crystal have been studied by three different techniques: Hemispherically scanned x-ray photoelectron diffraction, convergent beam electron diffraction, and chemical etching. We conclude that Ga-polar surfaces are resistant to a 200 °C molten NaOH+KOH etching whereas N-polar surfaces are chemically active. All the observed flat GaN films grown on (0001) sapphire have Ga polarity. On the contrary, the native flat faces of undoped GaN bulk crystals have N polarity.

M. Seelmann-Eggebert

Papers

Polarity of (00.1) GaN epilayers grown on a (00.1) sapphire

Polarity determination for GaN films grown on (0001) sapphire and high-pressure-grown GaN single crystals