The present invention generally provides improved adhesion and oxidation resistance of carbon-containing layers without the need for an additional deposited layer. In one aspect, the invention treats an exposed surface of carbon-containing material, such as silicon carbide, with an inert gas plasma, such as a helium (He), argon (Ar), or other inert gas plasma, or an oxygen-containing plasma such as a nitrous oxide (N 2 O) plasma. Other carbon-containing materials can include organic polymeric materials, amorphous carbon, amorphous fluorocarbon, carbon containing oxides, and other carbon-containing materials. The plasma treatment is preferably performed in situ following the deposition of the layer to be treated. Preferably, the processing chamber in which in situ deposition and plasma treatment occurs is configured to deliver the same or similar precursors for the carbon-containing layer(s). However, the layer(s) can be deposited with different precursors. The invention also provides processing regimes that generate the treatment plasma and systems which use the treatment plasma. The carbon-containing material can be used in a variety of layers, such as barrier layers, etch stops, ARCs, passivation layers, and dielectric layers.

Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers

An integrated deposition system is provided which is capable of vaporizing low vapor pressure liquid precursors and delivering this vapor into a processing region for use in the fabrication of advanced integrated circuits. The integrated deposition system is made up of a heated exhaust system, a remote plasma generator, a processing chamber and a liquid delivery system which together provide a commercially viable and production worthy system for depositing high capacity dielectric materials from low vapor pressure precursors, anneal those films while also providing commercially viable in-situ cleaning capability.

Deposition reactor having vaporizing, mixing and cleaning capabilities

Method and apparatus for gettering fluorine from chamber material surfaces

A method for providing a dielectric film having enhanced adhesion and stability. The method includes a post deposition treatment that densifies the film in a reducing atmosphere to enhance stability if the film is to be cured ex-situ. The densification generally takes place in a reducing environment while heating the substrate. The densification treatment is particularly suitable for silicon-oxygen-carbon low dielectric constant films that have been deposited at low temperature.

Post-deposition treatment to enhance properties of Si-O-C low k films

A plasma enhanced chemical processing reactor (10) and method. The reactor (10) includes a plasma chamber (18) including a first gas injection manifold (15) and a source of electromagnetic energy (12). The plasma chamber is in communication with a process chamber (16) which includes a wafer support (20) and a second gas manifold (17). The plasma generated in the plasma chamber (18) extends into the process chamber (16) and interacts with the reactive gases to deposit a layer of material on the wafer (24). The reactor (10) also includes a vacuum system (26) for exhausting the reactor (10). The method includes the steps of generating a plasma within the plasma chamber (18), introducing at least one gaseous chemical into the process chamber (16) proximate to the wafer support (20) and applying r.f. gradient to induce diffusion of the plasma to the area proximate the wafer support (20).

A plasma enhanced chemical processing reactor and method

An improvement in a method for cleaning a CVD deposition chamber in a semiconductor wafer processing apparatus is described. The improvement comprises the treatment of fluorine residues in the CVD deposition chamber, left from a prior fluorine plasma cleaning step, by contacting such fluorine residues with one or more reducing gases which will react with the fluorine residues to form one or more gaseous or solid reaction products or a mixture of same.

Cleaning method for semiconductor wafer processing apparatus

A two step process is disclosed for forming a silicon oxide layer over a stepped surface of a semiconductor wafer while inhibiting the formation of voids in the oxide layer which comprises depositing a layer of an oxide of silicon over a stepped surface of a semiconductor wafer in a CVD chamber by flowing into the chamber a gaseous mixture comprising a source of oxygen, a portion of which comprises O3, and tetraethylorthosilicate as the gaseous source of silicon while maintaining the pressure in the CVD chamber within a range of from about 250 Torr to about 760 Torr and then depositing a second layer of oxide over the first layer in a CVD chamber by flowing into the chamber a gaseous mixture comprising a source of oxygen, a portion of which comprises O3 ; and tetraethylorthosilicate as the gaseous source of silicon while maintaining the CVD chamber at a lower pressure than during the first deposition step.

Two step process for forming void-free oxide layer over stepped surface of semiconductor wafer

Fixed amounts of a liquid source for a chemical vapor deposition process is supplied continuously from a source tank and through a liquid mass flow controller to a three-way valve. Inside the three-way valve, the liquid source is evaporated to generate a source gas by contacting a high-temperature carrier gas which flows therethrough and becomes mixed with the source gas. The gas mixture thus generated is supplied into a process chamber for a chemical vapor deposition process. The carrier gas may be heated by a gas heater before entering the three-way valve. Alternatively, the three-way valve may be enclosed inside a thermostatic container, the carrier gas being heated inside the container.

Chemical vapor deposition method and apparatus therefore

A composite BPSG insulating and planarizing layer is formed over stepped surfaces of a semiconductor wafer by a novel two step process. The composite BPSG layer is characterized by the absence of discernible voids and a surface which is resistant to loss of boron in a subsequent etching step. The two step deposition process comprises a first step to form a void-free BPSG layer by a CVD deposition using gaseous sources of phosphorus and boron dopants and tetraethylorthosilicate (TEOS) as the source of silicon; and then a second step to form a capping layer of BPSG by a plasma-assisted CVD deposition process while again using gaseous sources of phosphorus and boron dpoants, and TEOS as the source of silicon, to provide a BPSG cap layer having a surface which is non-hygroscopic and resistant to loss of boron by subsequent etching.

Method for forming a boron phosphorus silicate glass composite layer on a semiconductor wafer

A composite BPSG insulating and planarizing layer is formed over stepped surfaces of a semiconductor wafer by a novel two step process. The composite BPSG layer is characterized by the absence of discernible voids and a surface which is resistant to loss of boron in a subsequent etching step. The two step deposition process comprises a first step to form a void-free BPSG layer by a CVD deposition using gaseous sources of phosphorus and boron dopants and tetraethylorthosilicate (TEOS) as the source of silicon; and then a second step to form a capping layer of BPSG by a plasma-assisted CVD deposition process while again using gaseous sources of phosphorus and boron dopants, and TEOS as the source of silicon, to provide a BPSG cap layer having a surface which is non-hygroscopic and resistant to loss of boron by subsequent etching.

Makoto Nagashima

Papers

Cleaning method for semiconductor wafer processing apparatus

Two step process for forming void-free oxide layer over stepped surface of semiconductor wafer

Chemical vapor deposition method and apparatus therefore

Method for forming a boron phosphorus silicate glass composite layer on a semiconductor wafer

Boron phosphorus silicate glass composite layer on semiconductor wafer