Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally-renowned authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model, and SiGe-base bipolar devices.

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Fundamentals of Modern VLSI Devices

A system of Flash EEprom memory chips with controlling circuits serves as non-volatile memory such as that provided by magnetic disk drives. Improvements include selective multiple sector erase, in which any combinations of Flash sectors may be erased together. Selective sectors among the selected combination may also be de-selected during the erase operation. Another improvement is the ability to remap and replace defective cells with substitute cells. The remapping is performed automatically as soon as a defective cell is detected. When the number of defects in a Flash sector becomes large, the whole sector is remapped. Yet another improvement is the use of a write cache to reduce the number of writes to the Flash EEprom memory, thereby minimizing the stress to the device from undergoing too many write/erase cycling.

Flash EEprom system

Structures, methods of manufacturing and methods of use of electrically programmable read only memories (EPROM) and flash electrically erasable and programmable read only memories (EEPROM) include split channel and other cell configurations. An arrangement of elements and cooperative processes of manufacture provide self-alignment of the elements. An intelligent programming technique allows each memory cell to store more than the usual one bit of information. An intelligent erase algorithm prolongs the useful life of the memory cells. Use of these various features provides a memory having a very high storage density and a long life, making it particularly useful as a solid state memory in place of magnetic disk storage devices in computer systems.

Highly compact EPROM and flash EEPROM devices

Improvements in the circuits and techniques for read, write and erase of EEprom memory enable nonvolatile multi-state memory to operate with enhanced performance over an extended period of time. In the improved circuits for normal read, and read between write or erase for verification, the reading is made relative to a set of threshold levels as provided by a corresponding set of reference cells which closely track and make adjustment for the variations presented by the memory cells. In one embodiment, each Flash sector of memory cells has its own reference cells for reading the cells in the sector, and a set of reference cells also exists for the whole memory chip acting as a master reference. In another embodiment, the reading is made relative to a set of threshold levels simultaneously by means of a one-to-many current mirror circuit. In improved write or erase circuits, verification of the written or erased data is done in parallel on a group of memory cells at a time and a circuit selectively inhibits further write or erase to those cells which have been correctly verified. Other improvements includes programming the ground state after erase, independent and variable power supply for the control gate of EEprom memory cells.

Multi-state EEprom read and write circuits and techniques

Maximized multi-state compaction and more tolerance in memory state behavior is achieved through a flexible, self-consistent and self-adapting mode of detection, covering a wide dynamic range. For high density multi-state encoding, this approach borders on full analog treatment, dictating analog techniques including A to D type conversion to reconstruct and process the data. In accordance with the teachings of this invention, the memory array is read with high fidelity, not to provide actual final digital data, but rather to provide raw data accurately reflecting the analog storage state, which information is sent to a memory controller for analysis and detection of the actual final digital data.

Multi-state memory

The time required for the program verify and erase verify operations can be shortened. The change of threshold values of memory cells can be suppressed even if the write and erase operations are executed repetitively. After the program and erase operations, whether the operations were properly executed can be judged simultaneously for all bit lines basing upon a change, after the pre-charge, of the potential at each bit line, without changing the column address. In the data rewrite operation, the rewrite operation is not effected for a memory cell with the data once properly written, by changing the data in the data register.

Non-volatile semiconductor memory device and memory system using the same

A new Flash Electrically Erasable-PROM cell with single transistor per bit as same as conventional UV-EPROM(1) (2) and suitable for 256K bit F-E2PROM with rather conservative 2.0µm design rule is described. The cell is programmed by a channel hot carrier injection mechanism similar to EPROM. The contents of all memory cells are simultaneously erased by using field emission of electrons from a floating gate to an erase gate in a flash. The F-E2PROM cell with single transistor per bit consists of three layers of polysilicon with select transistor. (3) (4) (5) Programming is 10msec per bit as same as UV-EPROM. Good erasing characteristics is obtained with 550A of oxide thickness between floating gate and erase gate.

A new flash E 2 PROM cell using triple polysilicon technology

A semiconductor device comprises a plurality of data supply circuits, output circuits for producing a plurality of data delivered from the data supply circuit and delay circuit for transferring respective data from each data supply circuit to a different output circuit with a different delay time. Each data supply circuit includes a plurality of row lines, a row decoder for selecting the row line in response to an address signal, a plurality of memory cell arrays including memory cells selectively driven by the row line and storing data, a plurality of column lines to receive data read out from the memory cell array, and a column decoder for selecting said column lines. The delay circuit prevents a plurality of data from being simultaneously outputted.

Semiconductor memory with delay means to reduce peak currents

A current-controlling MOS transistor is connected between a power source and an MOS circuit. A control voltage which has a level related to temperature is applied to the gate electrode of the control MOS transistor in order to compensate for current reduction at high temperatures due to the lowering of the mobility of minority carriers. The response time of the MOS circuit is made less dependent on temperature as a result of the current compensation.

Semiconductor integrated circuit with a response time compensated with respect to temperature

A semiconductor integrated circuit includes a CMOS circuit operated on a voltage of a first voltage level to set an output node thereof to a voltage of the first voltage level or a reference voltage; an output circuit for controlling supply of a voltage of a second voltage level which is higher than the first voltage level to a signal output node; and an isolation MOS transistor having a current path connected between the output node of the CMOS circuit and the signal output node and a gate connected to receive a control signal. The output node of the CMOS circuit is set to the reference voltage with the conduction resistance of the isolation MOS transistor kept high after the lapse of period in which the voltage of the second voltage level is kept supplied to the signal output node. After this, the conduction resistance of the isolation MOS transistor is reduced in response to the control signal.

Masamichi Asano

Papers

Non-volatile semiconductor memory device and memory system using the same

A new flash E 2 PROM cell using triple polysilicon technology

Semiconductor memory with delay means to reduce peak currents

Semiconductor integrated circuit with a response time compensated with respect to temperature

High voltage booster circuit for use in EEPROMs