An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Process gas discharged from a bypass pipe to a gas exhaust system can be prevented from diffusing back to the inside of a process chamber without having to install a dedicated vacuum pump at the downstream side of the bypass pipe. The substrate processing apparatus includes a process chamber accommodating a substrate, a gas supply system supplying process gas from a process gas source to the process chamber for processing the substrate, a gas exhaust system configured to exhaust the process chamber, two or more vacuum pumps installed in series at the gas exhaust system, and a bypass pipe connected between the gas supply system and the gas exhaust system. The most upstream one of the vacuum pumps is a mechanical booster pump, and the bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the mechanical booster pump.

Substrate Processing Apparatus

A power semiconductor module with its thermal resistance and overall size reduced Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power semiconductor chip by using, for example, soldering Metal layers are disposed also on the reverse surfaces of the insulating substrates and the metal layers are joined to the heat spreaders by using brazing Heat radiating fins are provided on the heat radiating surface of at least one of the heat spreaders The heat radiating side of each of the heat spreaders is covered by a casing to form a refrigerant chamber through which refrigerant flows to remove heat transmitted from the semiconductor chip to the heat spreader

Power semiconductor module

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.

Process feed management for semiconductor substrate processing

A method of forming an insulation film by alternating multiple times, respectively, a process of adsorbing a precursor onto a substrate and a process of treating the adsorbed surface using reactant gas and a plasma, wherein a plasma is applied in the process of supplying the precursor.

Method of forming insulation film by modified PEALD

A substrate holder employed for MOCVD and supporting a wafer on which crystal growth proceeds includes a molybdenum holder body, a GaAs polycrystalline film with a flat surface grown on a part of the surface of the molybdenum holder body where the wafer is absent, and an InP polycrystalline film grown on the GaAs polycrystalline film. Each of the polycrystalline films is grown to a thickness of 0.3 μm or more at a temperature higher than the epitaxial growth temperature of 575° C. During the MOCVD process, the emissivity of the molybdenum substrate holder is stable at a value near the emissivity of the wafer on the substrate holder and, therefore, the decomposition ratio of PH3 gas on the substrate holder is stable at a value near the decomposition ratio on the wafer, whereby any variation of the incorporation ratio of P atoms in the grown InGaAsP, i.e., a variation of the composition of the InGaAsP, is reduced and run-to-run variations of the composition of the grown crystal are reduced.

Substrate holder for MOCVD

A semiconductor laser device comprises an n-type cladding layer, a p-type cladding layer, and an active layer which is sandwiched between the n-type cladding layer and the p-type cladding layer The p-type cladding layer contains magnesium as a dopant impurity Further, an n-type diffusion blocking layer of a nitride compound semiconductor material located between the active layer and the p-type cladding layer and is In x Al y Ga 1−x−y N, where x≧0, y≧0, and (x+y)<1 The n-type diffusion blocking layer preferably has a concentration of a dopant impurity producing n-type conductivity in a range from 5×10 17 cm −3 to 5×10 19 cm −3 

Semiconductor light-emitting devices

An integrated semiconductor laser and light modulator includes a semiconductor laser disposed at a first region on a semiconductor substrate, a light modulator of an electric field absorbing type disposed at a second region on the semiconductor substrate adjacent to the first region for outputting a modulated light by transmitting or absorbing the laser light generated in the semiconductor laser, a semiconductor laminated layer structure including a quantum well structure layer disposed in the first region and the second region on the semiconductor substrate, and a lattice mismatched layer having a lattice constant smaller than that of the semiconductor substrate, disposed on a part of the semiconductor laminated layer structure, in the second region. It is possible to enhance the transmission efficiency of the laser light to the light modulator and the quality of the active layer of the semiconductor laser and the light absorption layer of the light modulator. Thus, an integrated semiconductor laser and light modulator that has a high reliability and long lifetime is obtained.

Semiconductor lasers and methods for fabricating semiconductor lasers

Selective-area MOCVD growth for 1.3 μm laser diodes with a monolithically integrated waveguide lens

A laser diode includes a first n-cladding layer disposed on and lattice-matched to an n-semiconductor substrate, wherein the first n-cladding layer is n-AlGaInP or n-GaInP; a second n-cladding layer of n-AlGaAs supported by the first n-cladding layer; and an inserted layer disposed between the first n-cladding layer and the second n-cladding layer, wherein the inserted layer includes the same elements as the first n-cladding layer, the inserted layer has the same composition ratios of Al and Ga (and P) as the first n-cladding layer, and the inserted layer contains a lower composition ratio of In than the first n-cladding layer.

Masayoshi Takemi

Papers

Substrate holder for MOCVD

Semiconductor light-emitting devices

Semiconductor lasers and methods for fabricating semiconductor lasers

Selective-area MOCVD growth for 1.3 μm laser diodes with a monolithically integrated waveguide lens

Semiconductor device and manufacturing method therefor