A process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, preferably of an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of six carbon atoms or less. After electroplating, the tinplate is rinsed and the rinse water only needs to be treated for removal of tin ions prior to discharge by normal procedures.

High speed electroplating of tinplate

An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less carbon atoms and at least one hydroxy group, or (2) an aromatic organic compound having at least one hydroxyl group and no more than two independent or joined rings optionally substituted with an alkyl moiety of a total of twenty carbon atoms in one or six carbon atoms or less.

Tin, lead or tin/lead alloy electrolytes for high-speed electroplating.

The present invention relates to the use of an aqueous composition comprising tin ions optionally further alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive comprising a linear or branched polyimidazolium compound comprising the structural unit of formula (L1) for depositing tin or tin alloy containing layers and a process for depositing tin alloy layer onto a substrate.

Composition for tin alloy electroplating comprising leveling agent

AN AQUEOUS BATH FOR ELECTROPLATING TIN UPON VARIOUS CONDUCTIVE SUBSTRATES CONTAINS STAMNOUS ION, SULFATE RADICAL, AN IMIDAZOLINE DERIVATIE AND A HETEROCYCLIC ALDEHYDE. THE BATH IS HIGHLY ACID AND IS OPERABLE TO PRODUCE SMOOTH ADHERENT DEPOSITS OVER A WIDE RANGE OF CURRENT DENSITIES AND DEPOSITS OF SPECTRAL BRIGHTNESS WITH THE OPTIMUM FORMULATIONS.

Merton M Beckwith

Papers

Method and bath for electroplating tin