Patent
Method and bath for electroplating tin
George B Rynne,Merton M Beckwith +1 more
Reads0
Chats0
TLDR
An AQUEOUS BATH for ELECTROPLATING TIN UPON VARIOUS CONDUCTIVE SUBSTRates CONTAINS STAMNOUS ION, SULFATE RADICAL, IMIDAZOLINE DERIVATIE and a HETEROCYCLIC ALDEHYDE.Abstract:
AN AQUEOUS BATH FOR ELECTROPLATING TIN UPON VARIOUS CONDUCTIVE SUBSTRATES CONTAINS STAMNOUS ION, SULFATE RADICAL, AN IMIDAZOLINE DERIVATIE AND A HETEROCYCLIC ALDEHYDE. THE BATH IS HIGHLY ACID AND IS OPERABLE TO PRODUCE SMOOTH ADHERENT DEPOSITS OVER A WIDE RANGE OF CURRENT DENSITIES AND DEPOSITS OF SPECTRAL BRIGHTNESS WITH THE OPTIMUM FORMULATIONS.read more
Citations
More filters
Patent
High speed electroplating of tinplate
TL;DR: In this paper, a process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, was described.
Patent
Tin, lead or tin/lead alloy electrolytes for high-speed electroplating.
TL;DR: An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid, is described in this article.
Patent
Composition for tin alloy electroplating comprising leveling agent
TL;DR: In this paper, the use of an aqueous composition comprising tin ions optionally further alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive comprising a linear or branched polyimidazolium compound comprising the structural unit of formula (L1) for depositing tin or tin alloy containing layers and a process for deposition tin alloy layer onto a substrate.