A method with three embodiments of manufacturing metal lines and solder bumps using electroless deposition techniques. The first embodiment uses a PdSi x seed layer 50 for electroless deposition. The PdSi x layer 50 does not require activation. A metal line is formed on a barrier layer 20 and an adhesion layer 30. A Palladium silicide seed layer 50 is then formed and patterned. Ni, Pd or Cu is electroless deposited over the Palladium silicide layer 50 to form a metal line. The second embodiment selectively electrolessly deposits metal 140 over an Adhesion layer 130 composed of Poly Si, Al, or Ti. A photoresist pattern 132 is formed over the adhesion layer. A metal layer 140 of Cu or Ni is electrolessly deposited over the adhesion layer. The photoresist layer 132 is removed and the exposed portion of the adhesion layer 130 and the underlying barrier metal layer 120 are etched thereby forming a metal line. The third embodiment electroless deposits metal over a metal barrier layer that is roughen by chemical mechanical polishing. A solder bump is formed using an electroless deposition of Cu or Ni by: depositing an Al layer 220 and a barrier metal layer 230 over a substrate 10. The barrier layer 230 is polished and activated. Next, the aluminum layer 220 and the barrier metal layer 230 are patterned. A metal layer 240 is electroless deposited. Next a solder bump 250 is formed over the electroless metal layer 240.

Method of electroless plating copper on nitride barrier

Carriers for packaging semiconductor devices. Strips of such carriers. The carriers comprise a flexible transparent film base, and have adherent thereto discretionary conductor patterns and bonding pads on the interior extremities of the conductor patterns.

Semiconductor chip carriers and strips thereof

There are provided new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., or chemical reducing agents is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

Sensitized substrates for chemical metallization

Radiant energy imaged printed circuit boards are provided by treating an insulating base with a composition of a reducible metal salt and a radiant energy sensitive compound, exposing the treated base to radiant energy in selected areas to produce metallic nuclei in the form of a non-conducting real image of the desired circuit pattern, rinsing the exposed base to remove unexposed metal salts and exposing the real image to an electroless metal bath to build up conductor lines of electroless metal thereon. In an alternative procedure, conductor lines are built up by electroplating with the same or a different metal and, optionally, solder coating.

Method for the production of radiant energy imaged printed circuit boards

Non-conductive real images are formed on substrates by depositing reducible metal salt compositions thereon and exposing the coated substrates to radiant energy or a chemical reducing agent to reduce the metal salt to metallic nuclei and to produce a real image of metal, which is made clearer and built up by electroless metal deposition. The metal salt composition can either be selectively deposited and then exposed, or uniformly deposited and then selectively exposed, to produce the real image.

Process for the formation of real images and products produced thereby

A pattern capable of reducing thereon a precious metal is generated on a suitable substrate by first coating selected portions of the substrate with a solution, called a photopromoter, which contains a metal salt. The metal salt possesses two characteristics: (a) the oxidation state of the salt (i.e., of the metal ion) is alterable (either increasable or decreasable) by exposure of the salt to radiation of the proper wavelength; and (b) in either the original or the altered oxidation state (but not in both states) the salt is capable of reducing a precious metal, e.g., a metal of the platinum group such as palladium, platinum or rhodium, from a salt thereof. The photopromoter-coated substrate is next selectively exposed to the proper wavelength radiation to produce a pattern of the photopromoter salt capable of reducing the precious metal. The remainder of the salt is incapable of reducing the precious metal. The pattern may then be exposed to a solution containing a salt of the precious metal to reduce thereon the precious metal. Ultimately, the precious metal pattern may be used to reduce electrolessly a metal, such as copper, to produce a metallic pattern, such as an electric circuit pattern.

Method of generating precious metal-reducing patterns

A METHOD OF ELECTRODEPOSITING AMETAL COATING ON DISCRETE CONDUCTIVE PORTIONS IS DESCRIBED. THE METHOD COMPRISES IMMERSING THE DISCRETE CONDUCTIVE PORTIONS IN A STANDARD METAL PLATING BATH CONTAINING A SUITABLE ANODE. THE DISCRETE PORTIONS ARE THEN CONTACTED WITH A CATHODE FABRICATED OF A VALVE METAL MATERIAL, WHICH MATERIAL IS CAPABLE OF FUNCTIONING AS AN ELECTRODE BUT WHICH IS PASSIVE TO METAL DEPOSITION UPON ITS OWN SURFACES. A CURRENT DENSITY IS THEN MAINTAINED WITHIN THE PLATING SOLUTION WHICH IS SUFFICIENT TO METAL PLATE THE DISCRETE PORTONS TO A DESIRED THICKNESS. D R A W I N G

Michael Anthony Deangelo

Papers

Method of generating precious metal-reducing patterns

Method of electroplating discrete conductive regions