Patent
Method of electroplating discrete conductive regions
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TLDR
In this paper, a method of ELECTRODEPODEPOSITING AMETAL COATING on DISCRETE CONDUCTIVE PORTIONS is described, where the contraints of the contours are contacted with a cathode fused of a valve METAL MATERIAL, which is able to function as an ELECTRODE but is passive to METAL de-position.Abstract:
A METHOD OF ELECTRODEPOSITING AMETAL COATING ON DISCRETE CONDUCTIVE PORTIONS IS DESCRIBED. THE METHOD COMPRISES IMMERSING THE DISCRETE CONDUCTIVE PORTIONS IN A STANDARD METAL PLATING BATH CONTAINING A SUITABLE ANODE. THE DISCRETE PORTIONS ARE THEN CONTACTED WITH A CATHODE FABRICATED OF A VALVE METAL MATERIAL, WHICH MATERIAL IS CAPABLE OF FUNCTIONING AS AN ELECTRODE BUT WHICH IS PASSIVE TO METAL DEPOSITION UPON ITS OWN SURFACES. A CURRENT DENSITY IS THEN MAINTAINED WITHIN THE PLATING SOLUTION WHICH IS SUFFICIENT TO METAL PLATE THE DISCRETE PORTONS TO A DESIRED THICKNESS. D R A W I N Gread more
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Process for low density additive flexible circuits and harnesses
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