This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.

Curable epoxy resin-based adhesive compositions

We have developed a ligand-assisted copper(I)-catalyzed two sequential heteroarylation sequence. An intramolecular S-arylation is followed by an intermolecular N-arylation leading to the direct synthesis of N-aryl-2-aminobenzothiazoles. In most cases however, the 2-arylsulfanyl-arylcyanamide was the major product obtained via an intramolecular C―S bond formation, associated with C―S bond breakage, followed by an intermolecular S-arylation. The selectivity of this ligand-assisted reaction is quite different as compared to that of ligand-free reactions and the rates are much faster giving good yields of products. Various cyanamides can be prepared in excellent yields from their corresponding 1-substituted thioureas with or without the assistance of a ligand with a catalytic quantity of copper(I).

Copper(I)-Catalyzed Cascade Synthesis of 2-Arylsulfanyl- arylcyanamides

https://www.rsc.org/suppdata/GC/b9/b914283p/b914283p.pdf

A one-pot preparation of cyanamide from dithiocarbamate using molecular iodine

An efficient synthesis of cyanamide from amine promoted by a hypervalent iodine(III) reagent

A chip-on-chip type semiconductor electronic component which meets requirement of further density increase of semiconductor integrated circuits is provided. A semiconductor device is also provided. In the chip-on-chip type semiconductor electronic component, the circuit surface of a first semiconductor chip and the circuit surface of a second semiconductor chip are arranged to face each other. A distance (X) between the first semiconductor chip and the second semiconductor chip is 50µm or less, and the shortest distance (Y) between the side surface of the second semiconductor chip and a first external electrode is 1mm or less. The semiconductor device using such semiconductor electronic component is also provided.

Semiconductor electronic component and semiconductor device using the same

N-Cyanoimides: reactivity studies with amine nucleophiles

This invention relates to epoxy-based compositions useful as adhesives and sealants, and more particularly to underfill sealant, compositions with improved impact resistance.

Epoxy-based compositions having improved impact resistance

Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

A composition of matter in liquid form at a temperature of 50°C or less comprising a monofunctional benzoxazine compound embraced by the structure where R is a member selected from C1-40 alkyl, C2-40 alkenyl, each of which being optionally substituted or interupted by one or more O, N, S, C=O, COO, and NHC=O, and C6-20 aryl, m is 0-4, and R1-R5 are independently selected from C1-40 alkyl, C2-40 alkenyl, each of which is being optionally substituted or interupted by one ore more O, N, S, C=O, COOH, and NHC=O, and C6-20 aryl, and at least one of R1-R5 are present, is provided.

Michael G. Todd

Papers

N-Cyanoimides: reactivity studies with amine nucleophiles

Epoxy-based compositions having improved impact resistance

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

Benzoxazine containing compositions of matter and curable compositions made therewith

Benzoxazinhaltige stoffzusammensetzungen und daraus hergestellte härtbare zusammensetzungen