Polymer surface modification by plasmas and photons

In this review we propose to address the question: for the life-science researcher, what does X-ray microscopy have to offer that is not otherwise easily available?We will see that the answer depends on a combination of resolution, penetrating power, analytical sensitivity, compatibility with wet specimens, and the ease of image interpretation.

Soft X-ray microscopes and their biological applications

Microwave and RF plasmas are finding increasing use in materials processing, plasma chemistry, chemical analysis, and other fields. This is stimulating the search for suitable plasma sources. In the 1970s, electromagnetic surface waves were put to use to sustain plasmas and an efficient microwave device, called a surfatron, was developed for this purpose. Recent work has shown that such discharges can also operate at radio frequencies. A large number of on surface-wave plasmas experimental data have been accumulated-their modelling is well advanced and they have found applications in various fields of research and technology. This paper reviews the physical principles of operation and the design of surface-wave plasma sources. Since the wave launcher is the central component of the source, this review presents a unified description of several compact, efficient, and easy to operate launchers specifically intended for plasma generation that have been developed over the past fifteen years. It is now possible to sustain such plasmas at frequencies ranging from 1 MHz to 10 GHz, in a pressure domain extending from 10-5 Torr up to few times atmospheric pressure, and in a rich variety of plasma vessels and reaction chambers.

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Plasma sources based on the propagation of electromagnetic surface waves

Poly[1-(trimethylsilyl)-1-propyne] and related polymers: Synthesis, properties and functions

Lithographic Imaging Techniques for the Formation of Nanoscopic Features

A process is described that allows the use of the lift-off metallization technique with ultraviolet exposure of a single layer of ®AZ-type photoresist. The process consists of soaking the resist layer for a predetermined time either in chlorobenzene or other aromatic solvents such as toluene and benzene before or after exposure. After development, resist profiles with overhangs suitable for lift-off metallization are obtained. It appears that removal of solvent and low-molecular-weight resin from the ®AZ resist may be responsible for the observed differential development rates. In addition, the soak time and temperature behavior indicate a diffusion-type process.

Single-step optical lift-off process

The properties of poly‐(methyl methacrylate), a new electron resist developed at IBM Research, are presented in comparison to commercial photoresists under electron beam exposure. It is shown that methacrylate resist, with suitable processing, presents a means for submicron device fabrication with reasonable speed. Transistors with one‐ and half‐micron emitter stripe widths have been fabricated using this resist as a medium for diffusion masking with . Also, a method for producing high‐resolution, defect‐free masks through methacrylate resist is presented.

Electron Resists for Microcircuit and Mask Production

This paper examines the utility of four newly proposed positive resists whose processing combines electron-beam-induced degradation of certain polymers and, subsequently, in situ fractionation according to molecular weight. Positive-resist action in four systems formulated on this concept has been demonstrated. Typical sensitivity in electron-beam exposure is 10-4 coulomb/cm2. Two resists exhibit resolution better than 1 micron. One resist investigated in detail yields extremely clean edges in electron-beam exposure, is resistant to hydrofluoric acid etching baths, and appears otherwise applicable to the fabrication of circuit elements of submicron size.

High-resolution positive resists for electron-beam exposure

Methods are described for producing a needle probe tip having prescribed magnetic properties for a scanning magnetic force microscope (MFM) on a substrate positioned in an evacuated environment. A substantially rigid, nanometer-scale needle-like structure is produced by selective decomposition of a volatile organic compound by a highly focussed electron beam. Processing steps are described to obtain prescribed magnetic properties of such a needle probe structure; in particular, the fabrication of a single magnetic domain, with hard or soft magnetic properties at the distal end of the needle structure. Three dimensional probe tips are also achieved. These magnetic sensing probes allow magnetic imaging at the nanometer-scale level.

Nanometer scale probe for an atomic force microscope, and method for making the same

RESIST DEVELOPMENT CONTROL SYSTEM Abstract of the Disclosure In the process of developing exposed photoresist on a substrate, the endpoint in developing away all of the exposed positive photoresist or any other positive resist is detected by exposing a wafer with a predetermined pattern including an optical grating or other special pattern formed in the photoresist upon a test area. In a system employing this concept, a beam is diffracted by the optics of the grating only at a first angle until the resist forming the grating is removed by development. Then a sensor is activated when an angle of reflection is unblocked when the grating dis-appears. The system is then turned off to stop development by the sensor in an automatic system or, by the operator in a manual system. A double exposure technique is employed to produce the grating or other special pattern.

Michael Hatzakis

Papers

Single-step optical lift-off process

Electron Resists for Microcircuit and Mask Production

High-resolution positive resists for electron-beam exposure

Nanometer scale probe for an atomic force microscope, and method for making the same

Resist development control system