Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.

In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning

A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are induced in the substrate and travel past a structure of interest where the acoustic waves are sensed. Information concerning one or more characteristics of the structure is encoded in the wave. The encoded information is assessed to determine the characteristic of interest.

Optical acoustic substrate assessment system and method

An image information acquiring apparatus of the present invention includes an acoustic wave detector having, disposed on a reception surface thereof, a plurality of elements that detect acoustic waves generated by an object corresponding to a reconstruction area; an acoustic signal generator that generates acoustic signals that are used in image reconstruction, from the detected acoustic waves; an element selector that selects elements that are used in image reconstruction; and a reconstructor that performs image reconstruction of a point of interest using acoustic signals based on the acoustic waves detected by the selected elements, the image information acquiring apparatus being configured such that, for each selected element, there exists another selected element located at a symmetrical position with respect to a point at which the reception surface is intersected by a perpendicular line drawn from the point of interest to the reception surface.

Image information acquiring apparatus, image information acquiring method and image information acquiring program

Disclosed are methods and apparatus for imaging a rounded edge of a sample, such as a wafer with a beveled edge. In one embodiment, the system includes a curved diffuser having an internal surface for positioning towards the rounded edge of the sample and an external surface opposite the internal surface and light sources for generating a plurality of illumination beams adjacent to a plurality of positions on the external surface of the diffuser so that the diffuser outputs uniform light onto the rounded edge of the sample at a wide range of incident angles. The system further includes a sensor for receiving light scattered from the rounded edge of the sample in response to the incident light and generating a detected signal for generating an image. These elements are partially or entirely integrated into a compact assembly.

Miniaturized imaging apparatus for wafer edge

Systems, devices, and methods for an extraordinary optical transmission (EOT) image capture system comprising optical components to capture light corresponding to an object, an EOT filter device to receive the captured light and transmit wavelengths of interest, and an image sensor to receive the wavelengths of interest and capture an image corresponding to the object. The EOT filter device comprising a first EOT film with thickness T EOT1 and including upper and lower surfaces and a plurality of apertures having a pitch P 1 , a second EOT film with thickness T EOT2 and including upper and lower surfaces and a plurality of apertures having a pitch P 2 ; and an optical cavity disposed between the first and second EOT films, the optical cavity having a thickness T OC and a refractive index RI OC , wherein the EOT filter device transmits wavelengths of interest based on thicknesses T EOT1 and T EOT2 , pitches P 1 and P 2 , and thickness T OC .

Multi-layer extraordinary optical transmission filter systems, devices, and methods

A system for imposing and analyzing surface acoustic waves in a substrate to determine characteristics of the substrate is disclosed. Optical elements and arrangements for imposing and analyzing surface acoustic waves in a substrate are also disclosed. NSOM's, gratings, and nanolight elements may be used to impose surface acoustic waves in a substrate and may also be used to measure transient changes in the substrate due to the passage of surface acoustic waves therethrough.

Michael Kotelyanskii

Papers

Substrate analysis using surface acoustic wave metrology