M
Michel Koopmans
Researcher at Micron Technology
Publications - 18
Citations - 241
Michel Koopmans is an academic researcher from Micron Technology. The author has contributed to research in topics: Probe card & Wafer dicing. The author has an hindex of 6, co-authored 18 publications receiving 241 citations.
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Patent
Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
TL;DR: In this paper, a wafer segment may function as a heat sink to enhance heat transfer from the stacked dice in the resulting multi-die assembly, and the die stacks are fabricated at the wafer level on a base wafer, from which the Wafer segment and die stack are singulated after at least peripheral encapsulation.
Patent
Method for attaching semiconductor components to a substrate using local UV curing of dicing tape
TL;DR: In this article, a method and a system for attaching semiconductor components to a substrate is described, where the substrate is a leadframe and the components are semiconductor dice or packages contained on a component substrate such as a wafer.
Patent
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
TL;DR: Stacked semiconductor die assemblies with thermal spacers and associated systems and methods are described in this article, where a thermally conductive casing defines a cavity, a stack of first semiconductor dies within the cavity, and a second semiconductordie stacked relative to the stack of the first dies and carried by a package substrate.
Patent
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
TL;DR: Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed in this article, where a stencil having a plurality of apertures at least proximate to the workpiece is used.
Patent
Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages
TL;DR: In this article, a photo-imageable dielectric adhesive material is applied to a major surface of a semiconductor die and at least partially over conductive elements on the semiconductor dies.