M
Mohamed Chaker Zaghdoudi
Researcher at Institut national des sciences appliquées
Publications - 39
Citations - 499
Mohamed Chaker Zaghdoudi is an academic researcher from Institut national des sciences appliquées. The author has contributed to research in topics: Heat pipe & Heat transfer. The author has an hindex of 11, co-authored 38 publications receiving 429 citations. Previous affiliations of Mohamed Chaker Zaghdoudi include Carthage University & Centre national de la recherche scientifique.
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Journal ArticleDOI
Thermal control of electronic equipment by heat pipes
TL;DR: In this paper, a literature survey on the main heat pipe and micro heat pipe technologies developed for thermal control of electronic equipment has been carried out, and the best performances were achieved with Plesch's axially grooved flat miniature heat pipe, which is able to transfer a heat flux of about 60 W·cm−2.
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Effect of interfacial phenomena on evaporative heat transfer in micro heat pipes
TL;DR: In this paper, a three-dimensional steady-state model for predicting heat transfer in a micro heat pipe array is presented, where three coupled models, solving the microregion equations, the two-dimensional wall heat conduction problem and the longitudinal capillary two-phase flow have been developed.
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Study of the behaviour of a bubble in an electric field: steady shape and local fluid motion
TL;DR: In this article, the effects of a uniform electric field on bubbles were investigated in an isothermal dielectric fluid and the deformation of the bubble was shown to occur in the electric field direction and also electroconvective movements within and around the bubble.
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Nucleate pool boiling under dc electric field
TL;DR: In this article, an experimental study of the influence of a DC uniform electric field on the nucleate boiling heat transfer has been conducted and the results obtained by the proposed EHD model are in good agreement with the experimental results.
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Thermal performance of finned heat pipe system for Central Processing Unit cooling
TL;DR: In this article, the thermal performance of a finned air-cooled heat pipe system for CPU cooling is evaluated under different heat loads and the results indicate that the overall thermal resistance is the lowest for the thermosyphon position and it is hardly affected by the heat input power.