Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

Fundamental issues related to flow boiling in minichannels and microchannels

This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.

Assessment of high-heat-flux thermal management schemes

Flow boiling in small hydraulic diameter channels is becoming increasingly important in many diverse applications. The previous studies addressing the effects of the channel size on the flow patterns, and heat transfer and pressure drop performance are reviewed in the present paper. The fundamental questions related to the presence of nucleate boiling and characteristics of flow boiling in microchannels and minichannels in comparison to that in the conventional channel sizes (3 mm and above) are addressed. Also, the effect of heat exchanger configuration—single-channel and multichannel—on the heat transfer and pressure drop performance is reviewed. The areas for future research are identified.

PROTRACED COUNTERINSURGENCY: CHINESE COIN STRATEGY IN XINJIANG by MAJ J. Scott LaRonde, USA, 95 pages. In 1949, following the conclusion of its revolutionary war against the Chinese Nationalist forces, the People’s Liberation Army (PLA) peacefully occupied China’s western most province of Xinjiang. For nearly sixty years, the PLA has conducted a counterinsurgency against several, mostly Uyghur-led, separatist movements. Despite periods of significant violence, particularly in the early 1950s and again in the 1990s, the separatist forces have not gained momentum and remained at a level one insurgency. Mao ZeDeng is revered as a master insurgent and the father of Fourth Generation Warfare. Strategists in armies worldwide study his writings on revolutionary and guerilla warfare. This monograph concludes that Mao, as well as the communist leaders who followed him, was also successful at waging protracted counterinsurgency. For nearly sixty years, separatist movements in Xinjiang, Tibet, and Taiwan have all failed. This monograph analyzes the conflict in Xinjiang and concludes that the Chinese continue to defeat the separatist movement in Xinjiang through a strategy that counters Mao’s seven fundamentals of revolutionary warfare.

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High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks

Ultra-high critical heat flux (CHF) for subcooled water flow boiling—I: CHF data and parametric effects for small diameter tubes

Increased rate of heat dissipation from electronic chips was explored by the application of flow boiling in mini-channel (D = 2.54 mm) and micro-channel (D — 510 \\x,m) heat sinks with special emphasis on reducing pressure drop and coolant flow rate. A pressure drop model was developed that accounts for the single-phase inlet region, the singleand two-phase heated region, and the two-phase unheated outlet region. Inlet and outlet losses associated with the abrupt contraction and expansion, respectively, were also accounted for, and so were the effects of compressibility and flashing within the two-phase region. Overall, the major contributor to pressure drop was the acceleration caused by evaporation in the channels; however, compressibility effects proved significant for the micro-channel geometiy. Based upon practical considerations such as pressure drop, erosion, choking, clogging, and manufacturing ease, the mini-channel geometiy was determined to offer inherent advantages over the microchannel geometiy. The latter is preferred only in situations calling for dissipation of high heat fluxes where minimizing weight and liquid inventory is a must.

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

Mini-channel (D = 2.54 mm) and micro-channel (D = 510 pm) heat sinks with a 1-cm heated surface were tested for their high heat flux performance with flow boiling ofR-113. Experimental results yielded CHF values in excess of 200 W cm~ for flow rates less than 95 ml min~ (0.025 gpm) over a range of inlet subcooling from 10 to 32° C. Heat diffusion within the heat sink was analyzed to ascertain the optimum heat sink geometry in terms of channel spacing and overall thickness. A heat sink thickness to channel diameter ratio of 1.2 provided a good compromise between minimizing overall thermal resistance and structural integrity. A ratio of channel pitch to diameter of less than two produced negligible surface temperature gradients even with a surf ace heat flux of 200 Wcm~. To further aid in determining channel diameter for a specific cooling application, a pressure drop model was developed, which is presented in the second part of the study.

Morris B. Bowers

Papers

High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks

Ultra-high critical heat flux (CHF) for subcooled water flow boiling—I: CHF data and parametric effects for small diameter tubes

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints

Parametric Study of Ultra-High CHF in Highly Subcooled Water Flow Inside Small Diameter Tubes