Al2O3 films were deposited by atomic layer deposition (ALD) at temperatures as low as 33 °C in a viscous-flow reactor using alternating exposures of Al(CH3)3 (trimethylaluminum [TMA]) and H2O. Low-temperature Al2O3 ALD films have the potential to coat thermally fragile substrates such as organic, polymeric, or biological materials. The properties of low-temperature Al2O3 ALD films were investigated versus growth temperature by depositing films on Si(100) substrates and quartz crystal microbalance (QCM) sensors. Al2O3 film thicknesses, growth rates, densities, and optical properties were determined using surface profilometry, atomic force microscopy (AFM), QCM, and spectroscopic ellipsometry. Al2O3 film densities were lower at lower deposition temperatures. Al2O3 ALD film densities were 3.0 g/cm3 at 177 °C and 2.5 g/cm3 at 33 °C. AFM images showed that Al2O3 ALD films grown at low temperatures were very smooth with a root-mean-squared (RMS) roughness of only 4 ± 1 A. Current−voltage and capacitance−voltage...

Low-Temperature Al2O3 Atomic Layer Deposition

Polymers for flexible displays: From material selection to device applications

The barrier solutions presently available on the market all have their drawbacks, e.g. cost, water-sensitivity, opacity or perceived environmental bad-will. At the same time there is a trend to use more plastic-based packaging materials for different applications, e.g. as replacements for metal and glass containers. This situation has stimulated the industry to provide new, more efficient barrier solutions. The innovations go along five major lines: (a) thin, transparent vacuum-deposited coatings; (b) new barrier polymers as discrete layers; (c) blends of barrier polymers and standard polymers; (d) organic barrier coatings; and (e) nanocomposite materials. This paper provides a comprehensive review of the different approaches, outlining the principle behind each barrier technology, its performance, its potential and the companies developing and producing the materials. Copyright © 2003 John Wiley & Sons, Ltd.

Recent innovations in barrier technologies for plastic packaging—a review

Material challenge for flexible organic devices

One of the advantages of organic light-emitting devices (OLEDs) over other display technologies is the ability to fabricate them on flexible substrates. As polymer substrates do not offer the same barrier performance as glass, OLEDs on polymer substrates will require thin-film barriers on both the bottom and top side of the device layers for sufficient lifetimes. This article provides a review of permeation-barrier technologies as well as the current status of thin-film permeation barriers for OLEDs. Topics include the implications of various device structures, permeation rate measurement, background and state-of-the-art of barrier technology, and mechanical and optical considerations for effective barriers.

Thin-film permeation-barrier technology for flexible organic light-emitting devices

Plasma-enhanced chemical vapor deposition (PECVD) of SiOx thin coatings on polymer surfaces yields tough hybrid materials with the gas barrier properties and transparency of glass. Combination of these properties makes these materials ideally suited for food packaging and biomedical device applications. In this study, we employ a Non-Parametric Response Surface Methods optimization to identify the Magnetron-PECVD conditions responsible for superlative SiOx barrier coatings on poly(ethylene terephthalate) (PET). Oxygen and water vapor permeances of optimized PET/SiOx composites produced by hexamethyldisiloxane and trimethylsilane have been measured as functions of temperature and are found to exhibit Arrhenius behavior. The thermal activation energy for water vapor permeation, unlike that for oxygen permeation, depends on barrier performance and increases by as much as 20 kJ/mol with an increase in barrier efficacy. Examination of these materials by phase-imaging atomic force microscopy and energy-filtered...

N. G. Harvey

Papers

SiOx Gas Barrier Coatings on Polymer Substrates: Morphology and Gas Transport Considerations