Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

The equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow. A scheme presented for solving these equations permits the determination of heat sink dimensions that display the lowest thermal resistance between the hottest portion of the heat sink and the incoming fluid. Results from the present method are applied to heat sinks reported by previous investigators to study effects of their restrictions regarding the nature of the flow (laminar or turbulent), the ratio of fin thickness to channel width, or the aspect ratio of the fluid channel. Results indicate that when the pressure drop through the channels is small, laminar solutions yield lower thermal resistance than turbulent solutions. Conversely, when the pressure drop is large, the optimal thermal resistance is found in the turbulent region. With the relaxation of these constraints, configurations and dimensions found using the present procedure produce significant improvement in thermal resistance over those presented by all three previous studies. >

Heat sink optimization with application to microchannels

Analysis of microchannels for integrated cooling

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

Depleting energy resources have become the driving force for their conservation. Increasing the system efficiencies is one method by which sustainability of energy may be ensured, for which miniaturization has successfully provided solutions. Miniature heat exchangers, owing to their high thermal performance, have the potential to provide energy efficient systems. In addition, their characteristics of compactness, small size and lesser weight have attracted widespread applications. Various works on micro- and minichannel heat exchangers as heat sinks and heat exchangers have been reviewed in this paper. Currently employed fabrication techniques and different applications have been summarized. An overview of the single-phase thermo-hydraulic studies in micro- and minichannel heat sinks has been presented. Literatures related co-current, counter-current and cross-current micro- and minichannel heat exchangers have been discussed. Finally, the persisting lacunae of this technology drawn from the review have been pointed out.

Review of micro- and mini-channel heat sinks and heat exchangers for single phase fluids

The heat transfer between the coolant anti the heat sink contributes a significant fraction of the thermal resistance of a package. It has been widely recognized that the heat transfer can be increased by increasing the area of the heat sink in contact with the coolant, and therefore the use of fins is common. However it has not been generally recognized that for laminar flow in confined channels, the heat transfer coefficient is inversely proportional to the width of the channel. Narrow channel forced air heat sinks have been designed, built, and tested. Three different channel widths, 5, 10, and 25 mils, were investigated. The design of the sinks permit integrated circuits (IC's) on 1/2 in centers and printed circuit (PC) boards on I in centers. The measured values of individual heat sinks with 30 I/min air flow are 5.5, 3.7, and 3.4°C/W for 25,10, and 5 mil channel widths, respectively. These values are in good agreement with calculated values. A 16 chip package with chips on 1/2 in centers was assembled utilizing 10 mil channel width heat sinks. A plenum fitted over the sinks supplied air to each of the sinks from a single source. The measured values of thermal resistance of the four center dies were between 5.3 and 5.9°C/W. If the chips are mounted directly on the sink instead of on the alumina substrate, the thermal resistance would be reduced by about 2°C/W.

N. Goldberg

Papers

Narrow Channel Forced Air Heat Sink