scispace - formally typeset
N

Naveen S. Parakalla

Researcher at University of Illinois at Chicago

Publications -  4
Citations -  422

Naveen S. Parakalla is an academic researcher from University of Illinois at Chicago. The author has contributed to research in topics: Moisture & Leachate. The author has an hindex of 4, co-authored 4 publications receiving 365 citations.

Papers
More filters
Journal ArticleDOI

Geotechnical properties of fresh municipal solid waste at Orchard Hills Landfill, USA.

TL;DR: The results of a laboratory investigation to determine the geotechnical properties of fresh municipal solid waste collected from the working phase of Orchard Hills Landfill showed that strain-dependent shear strength properties should be properly accounted in the stability analysis of bioreactor landfills.
Journal ArticleDOI

Compressibility and shear strength of municipal solid waste under short-term leachate recirculation operations.

TL;DR: This paper describes a comprehensive laboratory study performed to investigate the compressibility and shear strength properties of 1.5-year-old municipal solid waste (MSW) exhumed from a landfill cell where low amounts of leachate were recirculated.
Journal ArticleDOI

Hydraulic Conductivity of MSW in Landfills

TL;DR: In this paper, a series of laboratory tests was conducted using shredded fresh and landfilled municipal solid waste (MSW) from the Orchard Hills landfill (Illinois, United States) using two different small-scale and large-scale rigid-wall permeameters and a small scale triaxial permeameter.
Journal ArticleDOI

Experimental and statistical evaluation of compressibility of fresh and landfilled municipal solid waste under elevated moisture contents

TL;DR: In this paper, the variability associated with primary and secondary compression indices of municipal solid waste (MSW) was investigated in a controlled laboratory experimental program to quantify the compressibility of fresh MSW and landfilled MSW (subjected to leachate recirculation for a year in the field).