Fiber-based structures are highly desirable for wearable electronics that are expected to be light-weight, long-lasting, flexible, and conformable Many fibrous structures have been manufactured by well-established lost-effective textile processing technologies, normally at ambient conditions The advancement of nanotechnology has made it feasible to build electronic devices directly on the surface or inside of single fibers, which have typical thickness of several to tens microns However, imparting electronic functions to porous, highly deformable and three-dimensional fiber assemblies and maintaining them during wear represent great challenges from both views of fundamental understanding and practical implementation This article attempts to critically review the current state-of-arts with respect to materials, fabrication techniques, and structural design of devices as well as applications of the fiber-based wearable electronic products In addition, this review elaborates the performance requirements of the fiber-based wearable electronic products, especially regarding the correlation among materials, fiber/textile structures and electronic as well as mechanical functionalities of fiber-based electronic devices Finally, discussions will be presented regarding to limitations of current materials, fabrication techniques, devices concerning manufacturability and performance as well as scientific understanding that must be improved prior to their wide adoption

Fiber‐Based Wearable Electronics: A Review of Materials, Fabrication, Devices, and Applications

The world is recently witnessing an explosive development of novel electronic and optoelectronic devices that demand more-reliable power sources that combine higher energy density and longer-term durability. Supercapacitors have become one of the most promising energy-storage systems, as they present multifold advantages of high power density, fast charging-discharging, and long cyclic stability. However, the intrinsically low energy density inherent to traditional supercapacitors severely limits their widespread applications, triggering researchers to explore new types of supercapacitors with improved performance. Asymmetric supercapacitors (ASCs) assembled using two dissimilar electrode materials offer a distinct advantage of wide operational voltage window, and thereby significantly enhance the energy density. Recent progress made in the field of ASCs is critically reviewed, with the main focus on an extensive survey of the materials developed for ASC electrodes, as well as covering the progress made in the fabrication of ASC devices over the last few decades. Current challenges and a future outlook of the field of ASCs are also discussed.

Asymmetric Supercapacitor Electrodes and Devices.

A flexible and sensitive textile-based pressure sensor is developed using highly conductive fibers coated with dielectric rubber materials. The pressure sensor exhibits superior sensitivity, very fast response time, and high stability, compared with previous textile-based pressure sensors. By using a weaving method, the pressure sensor can be applied to make smart gloves and clothes that can control machines wirelessly as human-machine interfaces.

Conductive Fiber‐Based Ultrasensitive Textile Pressure Sensor for Wearable Electronics

This paper provides a review of recent developments in the rapidly changing and advancing field of smart fabric sensor and electronic textile technologies. It summarizes the basic principles and approaches employed when building fabric sensors as well as the most commonly used materials and techniques used in electronic textiles. This paper shows that sensing functionality can be created by intrinsic and extrinsic modifications to textile substrates depending on the level of integration into the fabric platform. The current work demonstrates that fabric sensors can be tailored to measure force, pressure, chemicals, humidity and temperature variations. Materials, connectors, fabric circuits, interconnects, encapsulation and fabrication methods associated with fabric technologies prove to be customizable and versatile but less robust than their conventional electronics counterparts. The findings of this survey suggest that a complete smart fabric system is possible through the integration of the different types of textile based functional elements. This work intends to be a starting point for standardization of smart fabric sensing techniques and e-textile fabrication methods.

https://iopscience.iop.org/article/10.1088/0964-1726/23/5/053001/pdf

Smart fabric sensors and e-textile technologies: a review

We describe the design, fabrication, and calibration of a highly compliant artificial skin sensor. The sensor consists of multilayered mircochannels in an elastomer matrix filled with a conductive liquid, capable of detecting multiaxis strains and contact pressure. A novel manufacturing method comprised of layered molding and casting processes is demonstrated to fabricate the multilayered soft sensor circuit. Silicone rubber layers with channel patterns, cast with 3-D printed molds, are bonded to create embedded microchannels, and a conductive liquid is injected into the microchannels. The channel dimensions are 200 μm (width) × 300 μm (height). The size of the sensor is 25 mm × 25 mm, and the thickness is approximately 3.5 mm. The prototype is tested with a materials tester and showed linearity in strain sensing and nonlinearity in pressure sensing. The sensor signal is repeatable in both cases. The characteristic modulus of the skin prototype is approximately 63 kPa. The sensor is functional up to strains of approximately 250%.

Design and Fabrication of Soft Artificial Skin Using Embedded Microchannels and Liquid Conductors

The invention of the Jacquard weaving machine led to the concept of a stored "program" and "mechanized" binary information processing. This development served as the inspiration for C. Babbage's analytical engine-the precursor to the modern-day computer. Today, more than 200 years later, the link between textiles and computing is more realistic than ever. In this paper, we look at the synergistic relationship between textiles and computing and identify the need for their "integration" using tools provided by an emerging new field of research that combines the strengths and capabilities of electronics and textiles into one: electronic textiles, or e-textiles. E-textiles, also called smart fabrics, have not only "wearable" capabilities like any other garment, but also have local monitoring and computation, as well as wireless communication capabilities. Sensors and simple computational elements are embedded in e-textiles, as well as built into yarns, with the goal of gathering sensitive information, monitoring vital statistics, and sending them remotely (possibly over a wireless channel) for further processing. The paper provides an overview of existing efforts and associated challenges in this area, while describing possible venues and opportunities for future research.

/pdf/electronic-textiles-a-platform-for-pervasive-computing-22y43zpeyn.pdf

Electronic textiles: a platform for pervasive computing

Continuous advancements in semiconductor technology enable the design of complex systems-on-chips (SoCs) composed of tens or hundreds of IP cores. At the same time, the applications that need to run on such platforms have become increasingly complex and have tight power and performance requirements. Achieving a satisfactory design quality under these circumstances is only possible when both computation and communication refinement are performed efficiently, in an automated and synergistic manner. Consequently, formal and disciplined system-level design methodologies are in great demand for future multiprocessor design. This article provides a broad overview of some fundamental research issues and state-of-the-art solutions concerning both computation and communication aspects of system-level design. The methodology we advocate consists of developing abstract application and platform models, followed by application mapping onto the target platform, and then optimizing the overall system via performance analysis. In addition, a communication refinement step is critical for optimizing the communication infrastructure in this multiprocessor setup. Finally, simulation and prototyping can be used for accurate performance evaluation purposes.

Computation and communication refinement for multiprocessor SoC design: A system-level perspective

Wireless sensor networks operating on limited energy resources need to be power efficient to extend the system lifetime. This is especially challenging for video sensor networks due to the large volumes of data they need to process in short periods of time. Towards this end, this paper proposes two coordinated power management policies for video sensor networks. These policies are scalable as the system grows and flexible to video parameters and network characteristics. In addition to simulation results, our prototype demonstrates the feasibility of implementing these policies. Finally, the analytical framework we provide gives an upper bound for the achievable sleep fraction and insight into how adjusting select parameters will affect the performance of the power management policies.

/pdf/distributed-power-management-techniques-for-wireless-network-4gksj6oafy.pdf

Distributed power-management techniques for wireless network video systems

In this paper, we explore various design issues for coordinated distributed power management (CDPM) policies in wireless video sensor networks (VSNs). These CDPM policies help to efficiently power manage such networks while benefiting from the advantages gained by using distributed techniques. The design issues we explore include power management under dynamic and adaptive timeout thresholds, two-hop broadcast information dissemination, hybrid CDPM, and remote wakeup. Our investigations use an advanced, event-triggered VSN simulator, as well as a set of VSN prototype nodes we built as a proof-of-concept. Our prototype network includes four digital signal processing (DSP)-based wireless video nodes which form a small multi-hop network. Last but not least, we propose a novel analytical approach to predict the CDPM policy performance, and show that this analytical method matches the measured power savings in the prototype.

Coordinated Distributed Power Management with Video Sensor Networks: Analysis, Simulation, and Prototyping

The objective of this article is to introduce the use of Stochastic Automata Networks (SANs) as an effective formalism for application-architecture modeling in system-level average-case analysis for platform-based design. By platform, we mean a family of heterogeneous architectures that satisfy a set of architectural constraints imposed to allow re-use of hardware and software components. More precisely, we show how SANs can be used early in the design cycle to identify the best performance/power trade-offs among several application-architecture combinations. Having this information available not only helps avoid lengthy simulations for predicting power and performance figures, but also enables efficient mapping of different applications onto a chosen platform. We illustrate the benefits of our methodology by using the “Picture-in-Picture” video decoder as a driver application.

Nicholas H. Zamora

Papers

Electronic textiles: a platform for pervasive computing

Computation and communication refinement for multiprocessor SoC design: A system-level perspective

Distributed power-management techniques for wireless network video systems

Coordinated Distributed Power Management with Video Sensor Networks: Analysis, Simulation, and Prototyping

System-level performance/power analysis for platform-based design of multimedia applications