A radiation sensitive resin composition comprising (A) a fluorine-containing copolymer of hexafluoropropylene, at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and an unsaturated compound (B) an acid generating compound which generates an acid upon exposure to radiation; (C) a cross-linkable compound; and (D) an organic solvent. The composition suitable is useful for a negative resist for forming a mask for the production of a circuit such as a semiconductor integrated circuit or a thin film transistor circuit for liquid crystal displays as well as a material for forming a permanent film such as an interlaminar insulating film or a color filter protective film.

Radiation-sensitive resin composition

A salt represented by the formula (I-CC): wherein Q1 and Q2 each independently represent a fluorine atom etc., X1 represents a single bond etc., Y1 represents a C1-C36 aliphatic hydrocarbon group etc., A1 and A2 independently each represents a C1-C20 aliphatic hydrocarbon group etc., Ar1 represents a (m4+1)-valent C6-C20 aromatic hydrocarbon group which can have one or more substituents, B1 represents a single bond etc., B2 represents a group capable of being eliminated by the action of an acid, m1 and m2 independently each represents an integer of 0 to 2, m3 represents an integer of 1 to 3, with the proviso that m1 plus m2 plus m3 equals 3, and m4 represents an integer of 1 to 3, and a photoresist composition comprising the salt represented by the formula (I-CC) and a resin comprising a structural unit having an acid-labile group and being insoluble or poorly soluble in an aqueous alkali solution but becoming soluble in an aqueous alkali solution by the action of an acid.

Salt and photoresist composition containing the same

A positive photosensitive polysilazane composition which comprises: a modified polysilsesquiazane having basic structural units represented by the general formula -[SiR6(NR7)1.5]-, containing other structural units represented by the general formula -[SiR62NR7]- and/or [SiR63(NR7)0.5]- in an amount of 0.1 to 100 mol% based on the basic structural units, and having a number-average molecular weight of 100 to 100,000 (in the formulae, R?6 and R7? each independently represents hydrogen, C?1-3? alkyl, or (un)substituted phenyl); and a photo-acid generator. It preferably contains a water-soluble compound as a shape stabilizer. The composition is applied to a substrate and pattern-wise exposed to light. The coating film exposed is moistened and then developed with an aqueous alkali solution. The resultant pattern is wholly exposed to light, subsequently moistened again, and then burned. Thus, a fine silica-based ceramic film which has satisfactory properties and is suitable as an interlayer dielectric is formed in a short time.

Photosensitive polysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof

The present invention is directed to novel bipyridyl amine and ether compounds such as those of Formula (I): (I) (where R?1#191, R?2#191, R?3#191, X and Y are as defined herein) which are mGluR5 modulators useful in the treatment or prevention of diseases and conditions in which mGluR5 is involved, including but not limited to psychiatric and mood disorders such as schizophrenia, anxiety, depression, bipolar disorders, and panic, as well as in the treatment of pain, Parkinson’s disease, cognitive dysfunction, epilepsy, circadian rhythm and sleep disorders, such as shift-work induced sleep disorder and jet-lag, drug addiction, drug abuse, drug withdrawal, obesity and other diseases. The invention is also directed to pharmaceutical compositions comprising these compounds. This invention further provides a method of treatment of these disorders and conditions by the administration of an effective amount of these novel bipyridyl amine and/or ether compounds and/or compositions containing these compounds.

Bipyridyl amines and ethers as modulators of metabotropic glutamate receptor-5

Polymeren om te worden toegepast in antireflectiedeklagen en werkwijzen ter bereiding hiervan.

A chemical amplifying type positive photoresist composition, excellent in various properties, particularly in TDE resistance as well as sensitivity and resolution, and able to suppress unfavorable halation effect without deteriorating profile, which comprises (A) a resin which is converted to alkali-soluble from alkali-insoluble or only slightly alkali soluble by the action of an acid, (B) an acid generator, (C) a basic compound and (D) a fluorenone compound represented by the following formula (I): wherein R1, R2, R3, R4, R5, R6, R7 and R8 each independently represent hydrogen, alkyl having 1 to 6 carbon atoms which may be optionally substituted with halogen, halogen or nitro is provided; and a precise fine photoresist pattern can be formed in high precision using the photoresist composition.

Positive photoresist composition

A positive photo resist composition of chemical
amplifying type, 
which is excellent in various properties such as sensitivity,
resolution, heat resistance, film retention ratio,
applicability and profile and also excellent in time delay
effect resistance, and 
which comprises
 (A) a resin which is converted to alkali-soluble from
alkali-insoluble or alkali-slightly soluble by the action of
an acid, (B) an acid generator and (C) a dipyridyl compound represented by the following
formula (I):
 
wherein, Z represents an organic bonding group having at least
one hetero atom, and R 1 , R 2 , R 3 , R 4 , R 5 and R 6 each independently
represent hydrogen or an alkyl group having 1 to 4 carbon
atoms.

Nobuhito Fukui

Papers

Positive photoresist composition

Positive resist composition comprising a dipyridyl compound