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Positive photoresist composition

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TLDR
A chemical amplifying type positive photoresist composition, which is excellent in various properties, particularly in TDE resistance as well as sensitivity and resolution, and able to suppress unfavorable halation effect without deteriorating profile, is presented in this paper.
Abstract
A chemical amplifying type positive photoresist composition, excellent in various properties, particularly in TDE resistance as well as sensitivity and resolution, and able to suppress unfavorable halation effect without deteriorating profile, which comprises (A) a resin which is converted to alkali-soluble from alkali-insoluble or only slightly alkali soluble by the action of an acid, (B) an acid generator, (C) a basic compound and (D) a fluorenone compound represented by the following formula (I): wherein R1, R2, R3, R4, R5, R6, R7 and R8 each independently represent hydrogen, alkyl having 1 to 6 carbon atoms which may be optionally substituted with halogen, halogen or nitro is provided; and a precise fine photoresist pattern can be formed in high precision using the photoresist composition.

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Radiation-sensitive resin composition

TL;DR: In this paper, the problem of obtaining a radiation-sensitive compsn. which can form a good pattern and especially has high adhesion property to a substrate and which can easily be removed not by peeling with a peeling liquid but by dissolution peeling method, by incorporating at least an alkali-soluble resin having a specified compd. as one component of the monomers.
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