A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface.

Surface mount type crystal oscillator

An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

Environment-resistant module, micropackage and methods of manufacturing same

A lead wire led-out type crystal oscillator of constant temperature type for high stability is disclosed, which includes a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant. The heat supply body includes a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Constant temperature type crystal oscillator

A crystal support structure and oscillator package for ovenized oscillators that has improved thermal isolation of the crystal. The support has a glass tubular wall with helical coils. Airgaps are formed circumferentially around the wall. A conductive metal layer is located over the surface of the wall. One end of the wall is supporting and electrically connected to a crystal resonator. Another end of the wall is attached to and electrically connected to a substrate. The crystal support forms an electrical path between the crystal resonator and the substrate and thermally isolates the crystal resonator from the substrate.

High thermal resistivity crystal resonator support structure and oscillator package

An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Apparatus and method for thermal stabilization of pcb-mounted electronic components within an enclosed housing

A crystal resonator assembly is described wherein a piezo-electric resonator (14) is mounted over a heat conducting substrate (28) and one or more heat generating elements (40) are located on the substrate. The heating elements provide heat both by conduction and radiation and by virtue of the use of a heat conducting substrate enable a uniform and efficient heating of the crystal resonator to a desired oven temperature.

Oven-heated crystal resonator and oscillator assembly

Ofengesteuerte
Quarzresonatoranordnung, mit einer Basis (30); einem warmeleitfahigen, elektrisch
isolierenden Substrat (28), das eine Oberflache mit einer niedrigen Temperaturgradienten-Charakteristik
hat; einem Heizelement (40), das so auf dem Substrat (28) angebracht
ist, dass es dieses auf eine gewunschte
Temperatur im wesentlichen gleichmasig uber die Oberflache verlaufend
erwarmt,
um Strahlungswarme
und Leitungswarme von
der Substratoberflache
bereitzustellen; einem Quarzresonator (14), der Kontakte (16,
18) und eine allgemein flache Konstruktion hat, wobei der Quarzresonator
allgemein parallel mit der Oberflache des Substrats (28) angebracht
ist und warmeleitende
und elektrisch leitende Elemente (24, 26) von dem Substrat (28)
zu dem Quarzresonator (14) verlaufen, und wobei der Quarzresonator
(14) in nahem Abstand zu dem Substrat (28) liegt, um davon gleichmasig auf
eine gewunschte
Temperatur erwarmt
zu werden; elektrischen Zuleitungen (42), die auf der Basis
(30) positionierte elektrische Leiter (46) mit auf dem Substrat
befindlichen elektrischen Leitern (44) verbinden; einer Abdeckung...

Otmar Boser

Papers

Oven-heated crystal resonator and oscillator assembly

Ofengesteuerte Quarzresonatoranordnung und Oszillatoranordnung