THE DESIGN AND ANALYSIS OF EXPERIMENTS. By Oscar Kempthorne. New York, John Wiley and Sons, Inc., 1952. 631 pp. $8.50. This book by a teacher of statistics (as well as a consultant for \"experimenters\") is a comprehensive study of the philosophical background for the statistical design of experiment. It is necessary to have some facility with algebraic notation and manipulation to be able to use the volume intelligently. The problems are presented from the theoretical point of view, without such practical examples as would be helpful for those not acquainted with mathematics. The mathematical justification for the techniques is given. As a somewhat advanced treatment of the design and analysis of experiments, this volume will be interesting and helpful for many who approach statistics theoretically as well as practically. With emphasis on the \"why,\" and with description given broadly, the author relates the subject matter to the general theory of statistics and to the general problem of experimental inference. MARGARET J. ROBERTSON

The Design and Analysis of Experiments

Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review

Human skin is a remarkable organ. It consists of an integrated, stretchable network of sensors that relay information about tactile and thermal stimuli to the brain, allowing us to maneuver within our environment safely and effectively. Interest in large-area networks of electronic devices inspired by human skin is motivated by the promise of creating autonomous intelligent robots and biomimetic prosthetics, among other applications. The development of electronic networks comprised of flexible, stretchable, and robust devices that are compatible with large-area implementation and integrated with multiple functionalities is a testament to the progress in developing an electronic skin (e-skin) akin to human skin. E-skins are already capable of providing augmented performance over their organic counterpart, both in superior spatial resolution and thermal sensitivity. They could be further improved through the incorporation of additional functionalities (e.g., chemical and biological sensing) and desired properties (e.g., biodegradability and self-powering). Continued rapid progress in this area is promising for the development of a fully integrated e-skin in the near future.

25th Anniversary Article: The Evolution of Electronic Skin (E-Skin): A Brief History, Design Considerations, and Recent Progress

Thermal Conductivity of Polymer-Based Composites: Fundamentals and Applications

Biobased plastics and bionanocomposites: Current status and future opportunities

Thermo-hydrous behavior of dried un-blanched potato samples

PP-carbon CPC show interesting thermo-electrical properties, smooth resistivity increase with temperature up to 150°C and consequently high power dissipation on a wide temperature range. The addition of short carbon fibers to PP already formulated with carbon black increases sharply the electrical conductivity of the CPC but does not have much influence on thermal conductivity as it could have been expected from the favorable aspect ratio of the fibers. The simulations of the thermo-electrical behavior of the CPC under tension put into evidence a temperature gradient at high heat flux due to the low thermal conductivity, which may damage the material itself.

Simulation of electrical and thermal behavior of poly(propylene) / carbon filler conductive polymer composites

Infrared drying of water based varnish coated on elastomer substrate

In this paper, we present a first model carried out with Comsol Multiphysics® to model bread baking, considering heat and mass transfer coupled with the phenomenon of swelling. This model predicts the pressures, temperatures and water contents evolutions in the dough for different energy requests. First results obtained are analyzed according to various physical parameters in order to better apprehend interactions between the various mechanisms in the porous matrix.

Modeling Heat and Mass Transfer in Bread During Baking

Electrical power devoted to telecommunication industry will grow tremendously with the development of internet services [1] [2]. In a data centre, most of the energy supplied to the IT equipments is converted into heat and diffused in a closed volume. Thus, it is necessary to study solutions to reduce energy consumptions, particularly regarding air conditioning systems [3]. Air conditioning part represents from 30 to 50% of the whole energy consumption, particularly in data centres. For usual buildings, thermal energy losses through the walls are negligible, even in winter. Air conditioning system must be used to transfer heat power from the data centre to the outside. The use of free cooling can be an easy way to reduce the energy consumption. Furthermore, if the building construction is adapted (thermal inertia, thickness of the walls, flow rate…), an optimization is possible by using a night cool storage directly in the masonry. Previous studies related to small buildings have shown good results [4]. This paper describes a numerical study in order to define new conceptions of optimized telecommunication buildings. Walls are used in order to increase heat transfer and reduced cooling energy consumption.

Patrick Glouannec

Papers

Thermo-hydrous behavior of dried un-blanched potato samples

Simulation of electrical and thermal behavior of poly(propylene) / carbon filler conductive polymer composites

Infrared drying of water based varnish coated on elastomer substrate

Modeling Heat and Mass Transfer in Bread During Baking

Thermal model for data centre cooling