P
Paul Edward Gee
Researcher at Applied Materials
Publications - 10
Citations - 678
Paul Edward Gee is an academic researcher from Applied Materials. The author has contributed to research in topics: Silicon oxide & Layer (electronics). The author has an hindex of 7, co-authored 10 publications receiving 678 citations.
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Patent
Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen
TL;DR: In this paper, the authors described methods of depositing a silicon oxide layer on a substrate, which may include the steps of providing a substrate to a deposition chamber, generating an atomic oxygen precursor outside the deposition chamber and introducing the atomic oxygen precursors into the chamber.
Patent
Two silicon-containing precursors for gapfill enhancing dielectric liner
TL;DR: In this article, a conformal liner layer was proposed to improve the ability of the gap fill layer to grow more smoothly, fill trenches and produce a reduced quantity and/or size of voids within the silicon oxide filler material.
Patent
Gas mixing swirl insert assembly
TL;DR: In this article, a gas mixing system for semiconductor wafer processing chamber is described, where the gas mixing chamber and the transport tube are separated by a porous barrier that increases a duration of gas mixing in the mixing chamber before processes gases migrate into the transport tubes.
Patent
REDUCED PATTERN LOADING USING BIS(DIETHYLAMINO)SILANE (C8H22N2Si) AS SILICON PRECURSOR
TL;DR: In this paper, the authors describe methods of depositing dielectric layers on patterned substrates, and demonstrate that a relatively uniform growth rate can be achieved across the patterned substrate surface using BIS(DIETHYLAMINO)SILANE (BDEAS), ozone and molecular oxygen.
Patent
Vacuum chucking heater of axisymmetrical and uniform thermal profile
Siqing Lu,Balaji Chandrasekaran,Paul Edward Gee,Nitin K. Ingle,Dmitry Lubomirsky,Zheng Yuan,Ellie Yieh +6 more
TL;DR: In this article, an axisymmetrical and/or more uniform thermal profile of a vacuum chucker is described, where the chucking holes are disposed in non-intersecting portions of the grooves.