P
Paul F. Smith
Researcher at Applied Materials
Publications - 16
Citations - 740
Paul F. Smith is an academic researcher from Applied Materials. The author has contributed to research in topics: Eddy-current sensor & Layer (electronics). The author has an hindex of 8, co-authored 16 publications receiving 740 citations.
Papers
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Patent
In-situ electroless copper seed layer enhancement in an electroplating system
Robin Cheung,Daniel A. Carl,Yezdi N. Dordi,Peter Hey,Ratson Morad,Chen Lian-Yu,Paul F. Smith,Ashok Sinha +7 more
TL;DR: In this paper, a system that provides for electroless deposition performed in-situ with an electroplating process to minimize oxidation and other contaminants prior to the electroplated process is described.
Patent
Heater for processing chamber
Semyon Sherstinsky,Alison Gilliam,Paul F. Smith,Leonel A. Zuniga,Ted Yoshidome,Nitin Khurana,Rod Mosely,Umesh M. Kelkar,Joseph Yudovsky,Alan R. Popiolkowski +9 more
TL;DR: A gas delivery apparatus and a method for directing a flow of gas to the edge of a substrate at an angle to the radial direction of the substrate is described in this paper, where the gas is flowed over a portion of the surface to prevent reactive gases from depositing on selective portions of the polygonal substrate.
Patent
Reliability barrier integration for Cu application
Ming Xi,Paul F. Smith,Ling Chen,Michael X. Yang,Mei Chang,Fusen Chen,Christophe Marcadal,Jenny Lin +7 more
TL;DR: In this article, the authors present a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper, which consists of first forming a reliable barrier layer in the patterned features to prevent diffusion of the metal into the dielectric layer through which the pattern is formed.
Patent
Methods and apparatus for a cleaning process in a high temperature, corrosive, plasma environment
Jun Zhao,Lee Luo,Jia-Xiang Wang,Xiao Liang,Stefan Wolff,Talex Sajoto,Mei Chang,Paul F. Smith +7 more
TL;DR: In this paper, a thermal choke isolates the heater from its support shaft, reducing the thermal gradient across the heater to reduce the risk of breakage and improving temperature uniformity of the heater.
Patent
Plasma source for chamber cleaning and process
Dmitry Lubomirsky,Jang Gyoo Yang,Qiwei Liang,Matthew L. Miller,James Santosa,Xinglong Chen,Paul F. Smith +6 more
TL;DR: In this article, an apparatus for processing a substrate including a power source, a switch box coupled to the power source and the switch box having a switch interchangeable between a first position and a second position.