Showing papers by "Paul W. Coteus published in 2017"

A 12V-to-0.9V active-clamp forward converter power block with planar transformer, standing slab inductor and direct edge solder to motherboard

Abstract: DC-to-DC power supplies for CPUs or GPUs are critical components on the motherboard of modern computer systems Converting an intermediate bus voltage (eg 12 V) to the core voltage (∼09 V) of CPUs or GPUs must be efficient, compact and cost effective This paper proposes an active-clamp forward converter (ACFC) power block to supply core voltage on a motherboard The ACFC power block can be individually tested prior to assembly and vertically soldered onto the motherboard to save motherboard area A low loss, compact planar transformer is designed into the ACFC power block PCB A custom, standing slab inductor not only provides high inductance and high saturation current but also helps to mechanically support the power block A one-piece copper winding connects the transformer to the inductor, thereby reducing the DC loss in the current path Experimental results show a peak efficiency of 904% with a 12 V input and 09 V output for an output current of 25 A

Blue Gene/Q: Sequoia and Mira

Abstract: The ibm® Blue Gene®/q (bg/q) supercomputer system was developed in partnership between ibm, the Argonne National Laboratory, and the Lawrence Livermore National Laboratory. Blue Gene/Q is a bright example of the United States Department of Energy and IBM's capability and seamlessly brings together science and technology and the people that make this possible. Mira is a system, due in large part to the insights gained through years of partnership on the Blue Gene family among Argonne, Lawrence Livermore, and ibm. The ibm®Blue Gene®/l supercomputer debuted in November 2004, followed by the second generation three years later. Indeed, the second and third generations, called Blue Gene®/p and Blue Gene®/q, respectively, were conceived before Blue Gene/L was formally announced. With the deployment of Sequoia in Livermore, and the Mira 48-rack system in Argonne, Blue Gene/Q began to accumulate its trophies. The system software objectives on Blue Gene/Q are ultra-scalability, high reliability, and delivering the full performance capability of the hardware to applications.

Voltage control utilizing multiple PWM patterns

Abstract: A power-delivery system may comprise a load device and a direct-current converter configured to deliver current to the load device when the direct-current converter is in an on state. The power-deliver system may comprise a voltage-measurement system configured to measure, at a beginning of each measurement cycle in a cyclic measurement pattern, a voltage at the load device. The power-deliver system may comprise a power controller configure to receive, at the beginning of each measurement cycle, the measurement of the voltage, and to perform, at the beginning of a control cycle in a cyclic control pattern, a voltage-control decision in response to a change in the measurement of the voltage being below a voltage-change threshold. The voltage-control decision may comprise whether to switch the state of the first direct-current converter. The cyclic control pattern may operate at a first frequency, and the measurement pattern may operate at a second frequency.

Mechanically flexible cold plates for low power components

Abstract: An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.