Hitherto, two distinct families of multielement detector arrays have been used for infrared (IR) imaging system applications: linear arrays for scanning systems (first generation) and two-dimensional arrays for staring systems (second generation). Nowadays, third-generation IR systems are being developed which, in the common understanding, provide enhanced capabilities such as larger numbers of pixels, higher frame rates, better thermal resolution, multicolor functionality, and/or other on-chip signal-processing functions. In this paper, fundamental and technological issues associated with the development and exploitation of third-generation IR photon detectors are discussed. In this class of detectors the two main competitors, HgCdTe photodiodes and quantum-well photoconductors, are considered. This is followed by discussions focused on the most recently developed focal plane arrays based on type-II strained-layer superlattices and quantum dot IR photodetectors. The main challenges facing multicolor devi...

Third-generation infrared photodetector arrays

We presented an alternative design of type II superlattice photodiodes with the insertion of a mid-wavelength infrared M-structure AlSb∕GaSb∕InAs∕GaSb∕AlSb superlattice for the reduction of dark current. The M-structure superlattice has a larger carrier effective mass and a greater band discontinuity as compared to the standard type II superlattices at the valence band. It acts as an effective medium that weakens the diffusion and tunneling transport at the depletion region. As a result, a 10.5μm cutoff type II superlattice with 500nm M-superlattice barrier exhibited a R0A of 200Ωcm2 at 77K, approximately one order of magnitude higher than the design without the barrier. The quantum efficiency of such structures does not show dependence on either barrier thickness or applied bias.

Dark current suppression in type II InAs∕GaSb superlattice long wavelength infrared photodiodes with M-structure barrier

Progress in focal plane array technologies

In 1959, Lawson and co-workers published the paper which triggered development of variable band gap Hg1−xCdxTe (HgCdTe) alloys providing an unprecedented degree of freedom in infrared detector design. HgCdTe ternary alloy has been used for realization of detectors operating under various modalities including: photoconductor, photodiode, and metal-insulator-semiconductor detector designs. Over the last five decades, this material system has successfully overcome the challenges from other material systems. It is important to notice that none of these competitors can compete in terms of fundamental properties. The competition may represent more mature technology but not higher performance or, with the exception of thermal detectors, higher operating temperatures (HOTs) for ultimate performance. In the last two decades, several new concepts for improvement of the performance of photodetectors have been proposed. These new concepts are particularly addressing the drive towards the so called HOT detectors aiming to increase detector operating temperatures. In this paper, new strategies in photodetector designs are reviewed, including barrier detectors, unipolar barrier photodiodes, multistage detectors and trapping detectors. Some of these new solutions have emerged as a real competitor to HgCdTe photodetectors.

/pdf/new-concepts-in-infrared-photodetector-designs-4kqz0njzzg.pdf

New concepts in infrared photodetector designs

The first decade of the 21st-century has seen a rapid development in infrared photodetector technology. At the end of the last millennium there were two dominant IR systems, InSb- and HgCdTe-based detectors, which were well developed and available in commercial systems. While these two systems saw improvements over the last twelve years, their change has not nearly been as marked as that of the quantum-based detectors (i.e., QWIPs, QDIPs, DWELL-IPs, and SLS-based photodetectors). In this paper, we review the progress made in all of these systems over the last decade plus, compare the relative merits of the systems as they stand now, and discuss where some of the leading research groups in these fields are going to take these technologies in the years to come.

Progress in Infrared Photodetectors Since 2000

The authors report the dependence of the quantum efficiency on device thickness of type-II InAs∕GaSb superlattice photodetectors with a cutoff wavelength around 12μm. The quantum efficiency and responsivity show a clear delineation in comparison to the device thickness. An external single-pass quantum efficiency of 54% is obtained for a 12μm cutoff wavelength photodiodes with a π-region thickness of 6.0μm. The R0A value is kept stable for the range of structure thicknesses allowing for a specific detectivity (2.2×1011cmHz∕W).

Very high quantum efficiency in type-II InAs/GaSb superlattice photodiode with cutoff of 12 μm

Effective surface passivation of type-II InAs∕GaSb superlattice photodiodes with cutoff wavelengths in the long-wavelength infrared is presented. A stable passivation layer, the electrical properties of which do not change as a function of the ambient environment nor time, has been prepared by a solvent-based surface preparation, vacuum desorption, and the application of an insulating polyimide layer. Passivated photodiodes, with dimensions ranging from 400×400to25×25μm2, with a cutoff wavelength of ∼11μm, exhibited near bulk-limited R0A values of ∼12Ωcm2, surface resistivities in excess of 104Ωcm, and very uniform current-voltage behavior at 77K.

Near bulk-limited R0A of long-wavelength infrared type-II InAs/GaSb superlattice photodiodes with polyimide surface passivation

The utilization of the P+-π-M-N+ photodiode architecture in conjunction with a thick active region can significantly improve long wavelength infrared type-II InAs/GaSb superlattice photodiodes. By studying the effect of the depletion region placement on the quantum efficiency in a thick structure, we achieved a topside illuminated quantum efficiency of 50% for an N-on-P diode at 8.0 μm at 77 K. Both the double heterostructure design and the application of polyimide passivation greatly reduce the surface leakage, giving an R0A of 416 Ω cm2 for a 1% cutoff wavelength of 10.52 μm, a Shot–Johnson detectivity of 8.1×1011 cmHz/W at 77 K, and a background limited operating temperature of 110 K with 300 K background.

Background limited long wavelength infrared type-II InAs/GaSb superlattice photodiodes operating at 110 K

Focal plane array fabrication requires a well passivated material that is resistant to aggressive processes. The authors report on the ability of type-II InAs∕GaSb superlattice heterodiodes to be more resilient than homojunctions diodes in improving sidewall resistivity through the use of various passivation techniques. The heterostructure consisting of two wide band gap (5μm) superlattice contacts and a low band gap active region (11μm) exhibits an R0A averaging of 13Ωcm2. The devices passivated with SiO2, Na2S and SiO2 or polyimide did not degrade compared to the unpassivated sample and the resistivity of the sidewalls increased to 47kΩcm.

Pierre Yves Delaunay

Papers

Dark current suppression in type II InAs∕GaSb superlattice long wavelength infrared photodiodes with M-structure barrier

Very high quantum efficiency in type-II InAs/GaSb superlattice photodiode with cutoff of 12 μm

Near bulk-limited R0A of long-wavelength infrared type-II InAs/GaSb superlattice photodiodes with polyimide surface passivation

Background limited long wavelength infrared type-II InAs/GaSb superlattice photodiodes operating at 110 K

Passivation of type-II InAs∕GaSb double heterostructure