Preface to the Second Edition. Preface to the First Edition. 1 Introduction. 2 Network Analysis. 2.1 Network Variables. 2.2 Scattering Parameters. 2.3 Short-Circuit Admittance Parameters. 2.4 Open-Circuit Impedance Parameters. 2.5 ABCD Parameters. 2.6 Transmission-Line Networks. 2.7 Network Connections. 2.8 Network Parameter Conversions. 2.9 Symmetrical Network Analysis. 2.10 Multiport Networks. 2.11 Equivalent and Dual Network. 2.12 Multimode Networks. 3 Basic Concepts and Theories of Filters. 3.1 Transfer Functions. 3.2 Lowpass Prototype Filters and Elements. 3.3 Frequency and Element Transformations. 3.4 Immittance Inverters. 3.5 Richards' Transformation and Kuroda Identities. 3.6 Dissipation and Unloaded Quality Factor. 4 Transmission Lines and Components. 4.1 Microstrip Lines. 4.2 Coupled Lines. 4.3 Discontinuities and Components. 4.4 Other Types of Microstrip Lines. 4.5 Coplanar Waveguide (CPW). 4.6 Slotlines. 5 Lowpass and Bandpass Filters. 5.1 Lowpass Filters. 5.2 Bandpass Filters. 6 Highpass and Bandstop Filters. 6.1 Highpass Filters. 6.2 Bandstop Filters. 7 Coupled-Resonator Circuits. 7.1 General Coupling Matrix for Coupled-Resonator Filters. 7.2 General Theory of Couplings. 7.3 General Formulation for Extracting Coupling Coefficient k. 7.4 Formulation for Extracting External Quality Factor Qe. 7.5 Numerical Examples. 7.6 General Coupling Matrix Including Source and Load. 8 CAD for Low-Cost and High-Volume Production. 8.1 Computer-Aided Design (CAD) Tools. 8.2 Computer-Aided Analysis (CAA). 8.3 Filter Synthesis by Optimization. 8.4 CAD Examples. 9 Advanced RF/Microwave Filters. 9.1 Selective Filters with a Single Pair of Transmission Zeros. 9.2 Cascaded Quadruplet (CQ) Filters. 9.3 Trisection and Cascaded Trisection (CT) Filters. 9.4 Advanced Filters with Transmission-Line Inserted Inverters. 9.5 Linear-Phase Filters. 9.6 Extracted Pole Filters. 9.7 Canonical Filters. 9.8 Multiband Filters. 10 Compact Filters and Filter Miniaturization. 10.1 Miniature Open-Loop and Hairpin Resonator Filters. 10.2 Slow-Wave Resonator Filters. 10.3 Miniature Dual-Mode Resonator Filters. 10.4 Lumped-Element Filters. 10.5 Miniature Filters Using High Dielectric-Constant Substrates. 10.6 Multilayer Filters. 11 Superconducting Filters. 11.1 High-Temperature Superconducting (HTS) Materials. 11.2 HTS Filters for Mobile Communications. 11.3 HTS Filters for Satellite Communications. 11.4 HTS Filters for Radio Astronomy and Radar. 11.5 High-Power HTS Filters. 11.6 Cryogenic Package. 12 Ultra-Wideband (UWB) Filters. 12.1 UWB Filters with Short-Circuited Stubs. 12.2 UWB-Coupled Resonator Filters. 12.3 Quasilumped Element UWB Filters. 12.4 UWB Filters Using Cascaded Miniature High- And Lowpass Filters. 12.5 UWB Filters with Notch Band(s). 13 Tunable and Reconfigurable Filters. 13.1 Tunable Combline Filters. 13.2 Tunable Open-Loop Filters without Via-Hole Grounding. 13.3 Reconfigurable Dual-Mode Bandpass Filters. 13.4 Wideband Filters with Reconfigurable Bandwidth. 13.5 Reconfigurable UWB Filters. 13.6 RF MEMS Reconfigurable Filters. 13.7 Piezoelectric Transducer Tunable Filters. 13.8 Ferroelectric Tunable Filters. Appendix: Useful Constants and Data. A.1 Physical Constants. A.2 Conductivity of Metals at 25 C (298K). A.3 Electical Resistivity rho in 10-8 m of Metals. A.4 Properties of Dielectric Substrates. Index.

Microstrip filters for RF/microwave applications

This paper presents a physical model for planar spiral inductors on silicon, which accounts for eddy current effect in the conductor, crossover capacitance between the spiral and center-tap, capacitance between the spiral and substrate, substrate ohmic loss, and substrate capacitance. The model has been confirmed with measured results of inductors having a wide range of layout and process parameters. This scalable inductor model enables the prediction and optimization of inductor performance.

http://iulian.lmn.pub.ro/wiki_iulian/bibliografie/2000_Yue200_ED.pdf

Physical modeling of spiral inductors on silicon

Very accurate and simple equations are presented for both single and coupled microstrip lines' electrical parameters, i.e. impedances, effective dielectric constants, and attenuation including the effect of anisotropy in the substrate. For the single microstrip the effects of dispersion and non-zero strip thickness are also included.

Accurate Models for Microstrip Computer-Aided Design

In this paper, inkjet-printed UHF and microwave circuits fabricated on paper substrates are investigated for the first time as an approach that aims for a system-level solution for fast and ultra-low-cost mass production. First, the RF characteristics of the paper substrate are studied by using the microstrip ring resonator in order to characterize the relative permittivity (epsivr) and loss tangent (tan delta) of the substrate at the UHF band for the first time reported. A UHF RFID tag module is then developed with the inkjet-printing technology, proving this approach could function as an enabling technology for much simpler and faster fabrication on/in paper. Simulation and well-agreed measurement results, which show very good agreement, verify a good performance of the tag module. In addition, the possibility of multilayer RF structures on a paper substrate is explored, and a multilayer patch resonator bandpass filter demonstrates the feasibility of ultra-low-cost 3-D paper-on-paper RF/wireless structures.

/pdf/rfid-tag-and-rf-structures-on-a-paper-substrate-using-inkjet-1di4h0nxgu.pdf

RFID Tag and RF Structures on a Paper Substrate Using Inkjet-Printing Technology

Expressions are derived for the conductor loss in microstrip transmission lines. The formulas take into account the finite thickness of the strip conductor and apply to the mixed dielectric system. Good agreement with experimental data is obtained for rutile and alumina substrates.

Losses in Microstrip

A method based on the noise correlation technique and its applications is described. The package, which need not be reciprocal, may consist of an arbitrary interconnection of linear passive elements at thermal equilibrium. Only the terminal admittance properties of the package need be known. However, in certain special cases which lead to singular submatrices of the admittance matrix, the method is inapplicable. This situation can occur when elements such as isolators are part of the package. The necessary theoretical foundation and experimental techniques to enable workers not familiar with the field to assemble the software and laboratory setup for two-port noise de-embedding is provided. The automated noise measurement system used for data acquisition and the mathematical basis for it are described in some detail. The validity of the de-embedding approach is established with extensive experimental data obtained on three MESFETs and a pseudomorphic HEMT. >

A general noise de-embedding procedure for packaged two-port linear active devices

Formulas and graphs are presented for the effective relative permeability and the filling factors of magnetic substrates in microstrip. Both the propagation and the magnetic loss filling factors are included. In the calculation of these quantities, use was made of the filling factors for dielectric substrates obtained from Wheeler's analysis and a duality relationship between magnetic and dielectric substrates derived in this paper.

Microstrip Propagation on Magnetic Substrates - Part I: Design Theory

A new dielectric material has been developed with a temperature-stable dielectric constant of 38. The low loss exhibited at microwave frequencies, the excellent reproducibility, and the good mechanical properties of this dielectric make it an attractive substrate for microstrip circuits. The dielectric is also suitable for the resonant elements of dielectric filters and stabilizing cavities for hybrid solid-state sources.

R.A. Pucel

Papers

Losses in Microstrip

A general noise de-embedding procedure for packaged two-port linear active devices

Microstrip Propagation on Magnetic Substrates - Part I: Design Theory

A new low-loss high-k temperature-compensated dielectric for microwave applications

Correction to "Losses in Microstrip" (Correspondence)