Atmospheric pressure plasmas: A review

Gas discharge plasmas and their applications

Reactive species in non-equilibrium atmospheric-pressure plasmas: Generation, transport, and biological effects

Over the last ten years, expansion of atmospheric pressure plasma solutions for surface treatment of materials has been remarkable, however direct plasma technology for thin film deposition needs still great effort. The objective of this paper is to establish the state of the art on scientific and technologic locks, which have to be opened to consider direct atmospheric pressure plasma-enhanced chemical vapor deposition (AP-PECVD) a viable option for industrial application. Basic scientific principles to understand and optimize an AP-PECVD process are summarized. Laboratory reactor configurations are reviewed. Reference points for the design and use of AP-PECVD reactors according to the desired thin film properties are given. Finally, solutions to avoid powder formation and to increase the thin film growth rate are discussed.

Atmospheric Pressure Low Temperature Direct Plasma Technology: Status and Challenges for Thin Film Deposition

This paper is a state of the art of the understanding on the physics of homogeneous dielectric barrier discharge at atmospheric pressure. It is based on the analysis of present and previous work about the behavior of these discharges and the conditions to get them. Mechanisms controlling the homogeneity during gas breakdown and discharge development are successively discussed. The breakdown has to be a Townsend one, the ionization has to be slow enough to avoid a large avalanche development. During the breakdown, the discharge homogeneity is related to the ratio of the secondary emission at the cathode (γ coefficient) on the ionization in the gas bulk (α coefficient). Higher is this ratio, higher is the pressure × gas gap product (P.d.) value for which a Townsend breakdown is obtained. Among the phenomena enhancing the secondary emission there is the negative charge of the dielectric on the cathode surface, the trapping of ions in the gas and the existence of excited state having a long lifetime compared to the time between two consecutive discharges. The first phenomenon is always present when the electrodes are covered by a solid dielectric, the second one is related to the formation of a positive column and the third one is specific of the gas. During the discharge development, the homogeneity is mainly controlled by the voltage or the current imposed by the electrical circuit /electrode configuration and to the gas ability to be slowly ionized. Larger is the contribution of a multiple step ionization process like Penning ionization, higher will be the working domain of the discharge. A decrease of the gas voltage during the discharge development is a solution to enhance the contribution of this process. After 20 years of research a lot of mechanisms have been understood however there is still open questions like the nature of the Inhibited homogeneous DBD, surface energy transfers, role of attachment and detachment…

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Recent advances in the understanding of homogeneous dielectric barrier discharges

Dielectric barrier discharges (DBDs) at atmospheric pressure are obtained using mixtures of He and Ar as carrier gasses and various reactive additives such as hydrocarbons, hydrogen and nitrogen. These DBDs are used in three applications: deposition of polymer films; cleaning of Ag and Cu substrates; and activation of polyurethane and steel surfaces. In the case of the film deposition, several process conditions are investigated and the resulting films are analysed by scanning electron microscope, Fourier transform infrared spectroscopy and NMR. In another series of experiments Ag and Cu surfaces, covered with sulfide and oxide layers, are treated by means of a DBD in helium or argon with hydrogen added. The surfaces are analysed with X-ray photoelectron spectroscopy. Finally, a He–N2 plasma is used as an activator of polyurethane.

R Van De Leest

Papers

Application of atmospheric pressure dielectric barrier discharges in deposition, cleaning and activation.