A Three Dimensional Structure (3DS) Memory (100) allows for physical separation of the memory circuits (103) and the control logic circuit (101) onto different layers (103) such that each layer may be separately optimized. One control logic circuit (101) suffices for several memory circuits (103), reducing cost. Fabrication of 3DS memory (100) involves thinning of the memory circuit (103) to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections (105) are used. The 3DS memory (100) manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Three dimensional structure memory

A method and an apparatus to analyze two measured signals that are modeled as containing desired and undesired portions such as noise, FM and AM modulation. Coefficients relate the two signals according to a model defined in accordance with the present invention. In one embodiment, a transformation is used to evaluate a ratio of the two measured signals in order to find appropriate coefficients. The measured signals are then fed into a signal scrubber which uses the coefficients to remove the unwanted portions. The signal scrubbing is performed in either the time domain or in the frequency domain. The method and apparatus are particularly advantageous to blood oximetry and pulserate measurements. In another embodiment, an estimate of the pulserate is obtained by applying a set of rules to a spectral transform of the scrubbed signal. In another embodiment, an estimate of the pulserate is obtained by transforming the scrubbed signal from a first spectral domain into a second spectral domain. The pulserate is found by identifying the largest spectral peak in the second spectral domain.

Signal processing apparatus and method

The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.

Vertical system integration

Three dimensional structure integrated circuit

A smart card having a multi-layer substrate; a transponder module disposed in a first layer of the multi-layer substrate; a first antenna disposed in the first layer of the multi-layer substrate; and a second antenna disposed in a second layer of the multi-layer substrate. A switch and a capacitor in series with the second antenna. The first antenna may be tuned to a different frequency than the second antenna. An RFID chip and antenna in a mold mass disposed in a recess in the first layer of a substrate, behind a hologram disposed on the first layer of the substrate. The switch for the second antenna disposed under the RFID chip. A layer of ferrite material disposed between the hologram and the RFID chip. LEDs disposed behind the hologram.

Smart card with switchable matching antenna

A method and apparatus for testing circuit boards using two or a small number of probes for making resistive and radio frequency impedance measurements e.g. capacitive measurements. The combination of resistive and impedance measurements substantially reduces the number of tests required to verify the integrity of a circuit board. The impedance or capacitive "norm" values used in testing the circuit boards can be obtained by operating the system in a learning mode. Analysis of the data provides not only fault detection but also can indicate approximate fault location.

Method and apparatus for testing of electrical interconnection networks

This invention relates to an apparatus for making circuit boards in which insulated conductors are applied and bonded to a nonconductive surface to form a conductive path between contact points thereon in a predetermined precise pattern.

Apparatus for making scribed circuit boards and circuit board modifications

In a system for determining the relative position of a first object with respect to a second object, electrical detection of registration is achieved. This registration can be used during the manufacture of printed circuit boards or discrete wiring boards to determine the registration between layers of wiring, or between wiring layers and printed circuit layers. The system introduces an a.c. current at a suitable frequency into at least one first conductive pattern wired or etched or otherwise provided near the perimeter of a printed or wired first layer of a circuit board panel. The panel having the first pattern is moved relative to similarly wired second conductive patterns on a second layer or base plate, mounting table, etc., to which detection circuits are connected. Voltage induced in the second patterns is detected and indicates the positional relationship between the first and second conductive patterns and, hence, objects associated with such patterns. The system is well adapted for use in the manufacture of circuit boards, with errors between a distorted panel layer and the next succeeding layer may be evenly distributed or averaged to produce optimum results.

Multilevel circuit board precision positioning

A method of making self-supporting wire wound disc armatures by laminating the radial conductor portion of the armature and by coupling the winding to the commutator and hub by means of a laminate layer. The sequence of operations is arranged so that commutator connections can conveniently be made by hot staking and the commutator can be formed from a thin sheet metal blank.

Method of making laminated wire wound/armatures

A printed circuit armature for an electric motor comprising a cylindrical laminated core of low reluctance material. An inner layer of insulating material is concentrically bonded to the cylindrical laminated core, the inner layer having a plurality of printed circuit conductive elements arranged on its outer surface. An outer layer of insulating material is concentrically bonded to the inner layer of insulating material, the outer layer having a plurality of printed circuit conductive elements arranged on its outer surface, the conductive elements of the inner and outer layers being electrically connected. The conductive elements may be skewed to a maximum of about 3.degree. and the conductive elements of each layer are electrically interconnected so that the forces on the conductive elements, resulting from interaction of the current flowing in the conductors with the magnetic field, cooperate to apply a torque to the armature of the motor.

Raymond J Keogh

Papers

Method and apparatus for testing of electrical interconnection networks

Apparatus for making scribed circuit boards and circuit board modifications

Multilevel circuit board precision positioning

Method of making laminated wire wound/armatures

Printed circuit armature