This review highlights various aspects of current palladium membrane research and serves as a comprehensive bibliography covering palladium membrane preparation methods and applications. There are many promising uses for palladium membranes, although widespread use of the available technologies is constrained primarily by the high cost of palladium, lack of durability due to hydrogen embrittlement, and susceptibility to fouling. Various researchers in the field are tackling these problems and fabricating thinner palladium alloy composite membranes that better withstand contaminantion and thermal cycling. What has been accomplished to address these issues and the directions presently being explored are discussed.

Innovations in palladium membrane research

The properties of propagating surface plasmon polaritons (SPPs) along one-dimensional metal structures have been investigated for more than 10 years and are now well understood. Because of the high confinement of electromagnetic energy, propagating SPPs have been considered to represent one of the best potential ways to construct next-generation circuits that use light to overcome the speed limit of electronics. Many basic plasmonic components have already been developed. In this review, researches on plasmonic waveguides are reviewed from the perspective of plasmonic circuits. Several circuit components are constructed to demonstrate the basic function of an optical digital circuit. In the end of this review, a prototype for an SPP-based nanochip is proposed, and the problems associated with building such plasmonic circuits are discussed. A plasmonic chip that can be practically applied is expected to become available in the near future.

/pdf/nanoplasmonic-waveguides-towards-applications-in-integrated-w8rib95soq.pdf

Nanoplasmonic waveguides: towards applications in integrated nanophotonic circuits

Insulator-based (electrodeless) dielectrophoresis (iDEP) is an innovative approach in which the nonuniform electric field needed to drive DEP is produced by insulators, avoiding problems associated with the use of electrodes. Live and dead Escherichia coli were concentrated and selectively released by applying stepped DC voltages across a microchannel containing an array of insulating posts etched in glass. The only electrodes present were two platinum wires placed in the inlet and outlet reservoirs, producing mean electric fields of up to 200 V/mm across the insulators. The cells were labeled with Syto 9 and propidium iodide and imaged through a fluorescent microscope. Cell trapping and release were controlled by modifying the relative responses of electrokinesis and DEP by adjusting the magnitude of the applied voltage. Dead cells were observed to have significantly lower dielectrophoretic mobility than live cells, whereas the electrokinetic mobilities of live and dead cells were indistinguishable. The ...

http://ca.sandia.gov/microfluidics/research/pdfs/DielectroPre.pdf

Dielectrophoretic Concentration and Separation of Live and Dead Bacteria in an Array of Insulators

The technology for ohmic contacts to group III–V compound semiconductors is reviewed in this paper. The basic principles of current transport in metal-semiconductor (Schottky barrier) contacts are presented first. The modes of current transport considered are thermionic emission over the barrier, and tunneling through the barrier due to thermionic-field or field emission. Special attention is devoted to the parameters of temperature and doping concentration which determine the dominant mode of conduction. As the primary mode of conduction changes from thermionic emission dominated to tunneling dominated, the current-voltage behavior of the contact changes from rectifying to ohmic in character. The experimental techniques for fabricating ohmic contacts to III–V compound semiconductors are then described. Contact problems as they pertain to specific device applications are considered. Finally, present difficulties with contacts to mixed III–V crystals are discussed.

Richard Sard

Papers

The Nucleation, Growth, and Structure of Electroless Copper Deposits

Some Properties of Electroless Cobalt

Chemical Deposition of Single Crystal Gold Films