scispace - formally typeset
Journal ArticleDOI

The Nucleation, Growth, and Structure of Electroless Copper Deposits

Richard Sard
- 01 Jul 1970 - 
- Vol. 117, Iss: 7, pp 864-870
Reads0
Chats0
About
This article is published in Journal of The Electrochemical Society.The article was published on 1970-07-01. It has received 108 citations till now. The article focuses on the topics: Copper.

read more

Citations
More filters
Journal ArticleDOI

Innovations in palladium membrane research

TL;DR: A review of palladium membrane research can be found in this article, where the authors highlight various aspects of current palladium-based membrane research and serve as a comprehensive bibliography covering palladium preparation methods and applications.
Journal ArticleDOI

A review of the theory and technology for ohmic contacts to group III–V compound semiconductors

TL;DR: In this article, the basic principles of current transport in metal-semiconductor (Schottky barrier) contacts are presented, and the experimental techniques for fabricating ohmic contacts to III-V compound semiconductors are described.
Journal ArticleDOI

Electromagnetic interference shielding effectiveness of electroless Cu-plated PET fabrics

TL;DR: In order to develop the high quality electromagnetic interference (EMI) shielding textiles for protective clothing, polyester fabrics were electroless copper-plated as discussed by the authors, and the effects of pretreatment conditions such as scouring, etching, and catalyzation on electromagnetic interference shielding effectiveness (EMISE) and physical properties of treated fabrics were investigated.
Journal ArticleDOI

Polymer pretreatments for enhanced adhesion of metals deposited by the electroless process

TL;DR: In this paper, X-ray photoelectron spectroscopy has allowed to monitor the chemical and compositional surface modifications of polymer substrates (polypropylene, polycarbonate) subjected to plasma and UV or VUV irradiation (use of ArF* excimer laser and Xe2* incoherent excimer lamp, respectively).
Journal ArticleDOI

Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

TL;DR: The surface composition and the degree of quaternization of the graft-modified polyimide (PI) films were determined by X-ray photoelectron spectroscopy as discussed by the authors.
Related Papers (5)